发明申请
- 专利标题： OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES
- 专利标题（中）： 覆盖片材包装中的层压板和误差
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申请号： US12642479申请日： 2009-12-18
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公开(公告)号： US20110151627A1公开(公告)日： 2011-06-23
- 发明人: Richard S. Graf , Thomas E. Lombardi , Sudipta K. Ray , David J. West
- 申请人： Richard S. Graf , Thomas E. Lombardi , Sudipta K. Ray , David J. West
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H05K1/11
摘要：
An apparatus, system, and method are disclosed for connecting an integrated circuit device to a substrate. A plurality of standard diameter pillars and three or more increased diameter pillars are disposed on an integrated circuit device. The increased diameter pillars have a diameter that is greater than the standard diameter pillars and a height that is similar to the standard diameter pillars. The standard diameter pillars and the increased diameter pillars form a pattern on the integrated circuit device that corresponds to contact pads on a substrate opposite the integrated circuit device. A first group of solder bumps is disposed between the standard diameter pillars and the contact pads. A second group of solder bumps is disposed between the increased diameter pillars and the contact pads. The second group of solder bumps has pre-connection heights that are greater than pre-connection heights of the first group of solder bumps.
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