发明申请
- 专利标题: SEMICONDUCTOR DEVICE
- 专利标题(中): 半导体器件
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申请号: US13044322申请日: 2011-03-09
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公开(公告)号: US20110156156A1公开(公告)日: 2011-06-30
- 发明人: Kun-Hsien Lee , Cheng-Tung Huang , Wen-Han Hung , Shyh-Fann Ting , Li-Shian Jeng , Tzyy-Ming Cheng , Chia-Wen Liang
- 申请人: Kun-Hsien Lee , Cheng-Tung Huang , Wen-Han Hung , Shyh-Fann Ting , Li-Shian Jeng , Tzyy-Ming Cheng , Chia-Wen Liang
- 申请人地址: TW Hsinchu
- 专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人: UNITED MICROELECTRONICS CORP.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L27/092
- IPC分类号: H01L27/092
摘要:
A semiconductor device comprises a substrate, a first stress, and a second stress. The substrate has a first-type MOS transistor, an input/output (I/O) second-type MOS transistor, and a core second-type MOS transistor formed thereon. The first-type and the second-type are opposite conductivity types with respect to each other. The first stress layer is only disposed on the first-type MOS transistor, and the second stress layer is different from the first stress, and is only disposed on the core second-type MOS transistor. The I/O second-type MOS transistor is a type of I/O MOS transistor and without not noly the first stress layer but also the second stress layer disposed thereon, the core second-type MOS transistor is a type of core MOS transistor.
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