发明申请
- 专利标题： WAFER-TO-WAFER STACK WITH SUPPORTING PEDESTAL
- 专利标题（中）： 带支撑垫的散热器堆叠
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申请号： US12982046申请日： 2010-12-30
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公开(公告)号： US20110156249A1公开(公告)日： 2011-06-30
- 发明人: Chi-Shih Chang , Ra-Min Tain , Shyi-Ching Liau , Wei-Chung Lo , Rong-Shen Lee
- 申请人： Chi-Shih Chang , Ra-Min Tain , Shyi-Ching Liau , Wei-Chung Lo , Rong-Shen Lee
- 申请人地址： TW Hsinchu
- 专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人地址： TW Hsinchu
- 优先权： TW094137522 20051026
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An electronic device having a stacked structure is provided. The electronic device includes a first electronic layer, a second electronic layer disposed on the first electronic layer, and at least a post. The first electronic layer has a first interface, and including a first substrate and a first device layer disposed on the first substrate. The first interface is located between the first substrate and the first device layer, and the first device layer has a surface opposite to the first interface. The post is arranged in the first device layer, and extending from the first interface to the surface of the first device layer.
公开/授权文献
- US08810031B2 Wafer-to-wafer stack with supporting pedestal 公开/授权日：2014-08-19
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