发明申请
- 专利标题: Mounting structures for integrated circuit modules
- 专利标题(中): 集成电路模块的安装结构
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申请号: US13064081申请日: 2011-03-04
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公开(公告)号: US20110165736A1公开(公告)日: 2011-07-07
- 发明人: Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
- 申请人: Sung-Joo Park , Ki-Hyun Ko , Young Yun , Soo-Kyung Kim
- 优先权: KR10-2007-0007720 20070125
- 主分类号: H01L21/50
- IPC分类号: H01L21/50
摘要:
A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.
公开/授权文献
- US08399301B2 Mounting structures for integrated circuit modules 公开/授权日:2013-03-19