公开(公告)号：US08399301B2

公开(公告)日：2013-03-19

申请号：US13064081

申请日：2011-03-04

申请人： Sung-Joo Park ,  Ki-Hyun Ko ,  Young Yun ,  Soo-Kyung Kim

发明人： Sung-Joo Park ,  Ki-Hyun Ko ,  Young Yun ,  Soo-Kyung Kim

IPC分类号： H01L21/02

CPC分类号： H05K1/0246 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10522 ,  H01L2924/00

摘要： A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.

摘要翻译： 集成电路模块的结构包括布线板，多个集成电路和至少一个终端电阻电路。 布线板在其至少一个表面上具有安装区域。 多个集成电路安装在布线板的安装区域中并沿第一方向彼此间隔开。 至少一个终端电阻电路被布置在至少两个相邻的集成电路之间，并且耦合到多个集成电路的最后一个的输出端。

公开(公告)号：US20110165736A1

公开(公告)日：2011-07-07

申请号：US13064081

申请日：2011-03-04

申请人： Sung-Joo Park ,  Ki-Hyun Ko ,  Young Yun ,  Soo-Kyung Kim

发明人： Sung-Joo Park ,  Ki-Hyun Ko ,  Young Yun ,  Soo-Kyung Kim

IPC分类号： H01L21/50

CPC分类号： H05K1/0246 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10522 ,  H01L2924/00

摘要： A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.

摘要翻译： 集成电路模块的结构包括布线板，多个集成电路和至少一个终端电阻电路。 布线板在其至少一个表面上具有安装区域。 多个集成电路安装在布线板的安装区域中并沿第一方向彼此间隔开。 至少一个终端电阻电路被布置在至少两个相邻的集成电路之间，并且耦合到多个集成电路的最后一个的输出端。

公开(公告)号：US20080179649A1

公开(公告)日：2008-07-31

申请号：US12010138

申请日：2008-01-22

申请人： Sung-Joo Park ,  Ki-Hyun Ko ,  Young Yun ,  Soo-Kyung Kim

发明人： Sung-Joo Park ,  Ki-Hyun Ko ,  Young Yun ,  Soo-Kyung Kim

IPC分类号： H01L29/94 ,  H01L21/00

CPC分类号： H05K1/0246 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10522 ,  H01L2924/00

摘要： A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.

摘要翻译： 集成电路模块的结构包括布线板，多个集成电路和至少一个终端电阻电路。 布线板在其至少一个表面上具有安装区域。 多个集成电路安装在布线板的安装区域中并沿第一方向彼此间隔开。 至少一个终端电阻电路被布置在至少两个相邻的集成电路之间，并且耦合到多个集成电路的最后一个的输出端。

公开(公告)号：US07919841B2

公开(公告)日：2011-04-05

申请号：US12010138

申请日：2008-01-22

申请人： Sung-Joo Park ,  Ki-Hyun Ko ,  Young Yun ,  Soo-Kyung Kim

发明人： Sung-Joo Park ,  Ki-Hyun Ko ,  Young Yun ,  Soo-Kyung Kim

IPC分类号： H01L23/02

CPC分类号： H05K1/0246 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10522 ,  H01L2924/00

摘要： A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.

公开(公告)号：US08044506B2

公开(公告)日：2011-10-25

申请号：US12181488

申请日：2008-07-29

申请人： Young Yun ,  Soo-Kyung Kim ,  Kwang-Seop Kim ,  Ki-Hyun Ko ,  Sung-Joo Park

发明人： Young Yun ,  Soo-Kyung Kim ,  Kwang-Seop Kim ,  Ki-Hyun Ko ,  Sung-Joo Park

IPC分类号： H01L23/34

CPC分类号： H01L23/467 ,  G11C5/04 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K2201/0394 ,  H05K2201/09781 ,  H01L2924/00

摘要： The invention provides a thermal-emitting memory module, a thermal-emitting module socket, and a computer system comprising the thermal-emitting memory module and the thermal-emitting module socket. An embodiment of the thermal-emitting module includes: a module substrate having electrically-conductive traces; and a semiconductor device disposed on the module substrate and coupled to the electrically-conductive traces, the module substrate including a thermal-emitting portion disposed in proximity of the semiconductor device without directly contacting the semiconductor device.

摘要翻译： 本发明提供了一种发热存储器模块，热发射模块插座和包括热发射存储器模块和热发射模块插座的计算机系统。 热发射模块的一个实施例包括：具有导电迹线的模块衬底; 以及设置在所述模块基板上并耦合到所述导电迹线的半导体器件，所述模块基板包括设置在所述半导体器件附近的热发射部分而不直接接触所述半导体器件。

公开(公告)号：US20110163418A1

公开(公告)日：2011-07-07

申请号：US13064082

申请日：2011-03-04

申请人： Sung-Joo Park ,  Ki-Hyun Ko ,  Young Yun ,  Soo-Kyung Kim

发明人： Sung-Joo Park ,  Ki-Hyun Ko ,  Young Yun ,  Soo-Kyung Kim

IPC分类号： H01L27/02

CPC分类号： H05K1/0246 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10522 ,  H01L2924/00

摘要： A structure of an integrated circuit module includes a wiring board, a plurality of integrated circuits and at least one terminating resistance circuit. The wiring board has a mounting region on at least one surface thereof. The plurality of integrated circuits are mounted in the mounting region of the wiring board and spaced from one another in a first direction. The at least one terminating resistance circuit is arranged between at least two adjacent integrated circuits, and coupled to an output of a last of the plurality of integrated circuits.

公开(公告)号：US07738277B2

公开(公告)日：2010-06-15

申请号：US11905675

申请日：2007-10-03

申请人： Sungjoo Park ,  Ki-Hyun Ko ,  Young Yun ,  Sookyung Kim

发明人： Sungjoo Park ,  Ki-Hyun Ko ,  Young Yun ,  Sookyung Kim

IPC分类号： G11C5/06

CPC分类号： H01L25/0657 ,  G11C5/04 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

摘要： In one embodiment, the semiconductor memory device includes at least a first semiconductor memory die, and a surface of the semiconductor memory device includes a plurality of connectors. At least one of the plurality of connectors is electrically connected to the first semiconductor memory die. The plurality of connectors include at least first and second control signal connectors. The first control signal connector is for a first control signal of a first type, the second control signal connector is for a second control signal of the first type, and the first and second control signal connectors are disposed in different areas of the surface. For example, the first type may be a chip select signal, a clock enable signal, or an on die termination enable signal.

摘要翻译： 在一个实施例中，半导体存储器件至少包括第一半导体存储器管芯，并且半导体存储器件的表面包括多个连接器。 多个连接器中的至少一个电连接到第一半导体存储器管芯。 多个连接器包括至少第一和第二控制信号连接器。 第一控制信号连接器用于第一类型的第一控制信号，第二控制信号连接器用于第一类型的第二控制信号，并且第一和第二控制信号连接器设置在表面的不同区域中。 例如，第一类型可以是芯片选择信号，时钟使能信号或芯片上终止使能信号。

公开(公告)号：US20100214814A1

公开(公告)日：2010-08-26

申请号：US12774015

申请日：2010-05-05

申请人： Sungjoo Park ,  Ki-Hyun Ko ,  Young Yun ,  Sookyung Kim

发明人： Sungjoo Park ,  Ki-Hyun Ko ,  Young Yun ,  Sookyung Kim

IPC分类号： G11C5/06

CPC分类号： H01L25/0657 ,  G11C5/04 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

摘要： In one embodiment, the semiconductor memory device includes at least a first semiconductor memory die, and a surface of the semiconductor memory device includes a plurality of connectors. At least one of the plurality of connectors is electrically connected to the first semiconductor memory die. The plurality of connectors include at least first and second control signal connectors. The first control signal connector is for a first control signal of a first type, the second control signal connector is for a second control signal of the first type, and the first and second control signal connectors are disposed in different areas of the surface. For example, the first type may be a chip select signal, a clock enable signal, or an on die termination enable signal.

摘要翻译： 在一个实施例中，半导体存储器件至少包括第一半导体存储器管芯，并且半导体存储器件的表面包括多个连接器。 多个连接器中的至少一个电连接到第一半导体存储器管芯。 多个连接器包括至少第一和第二控制信号连接器。 第一控制信号连接器用于第一类型的第一控制信号，第二控制信号连接器用于第一类型的第二控制信号，并且第一和第二控制信号连接器设置在表面的不同区域中。 例如，第一类型可以是芯片选择信号，时钟使能信号或芯片上终止使能信号。

公开(公告)号：US07969761B2

公开(公告)日：2011-06-28

申请号：US12774015

申请日：2010-05-05

申请人： Sungjoo Park ,  Ki-Hyun Ko ,  Young Yun ,  Sookyung Kim

发明人： Sungjoo Park ,  Ki-Hyun Ko ,  Young Yun ,  Sookyung Kim

IPC分类号： G11C5/06

CPC分类号： H01L25/0657 ,  G11C5/04 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/00

摘要： In one embodiment, the semiconductor memory device includes at least a first semiconductor memory die, and a surface of the semiconductor memory device includes a plurality of connectors. At least one of the plurality of connectors is electrically connected to the first semiconductor memory die. The plurality of connectors include at least first and second control signal connectors. The first control signal connector is for a first control signal of a first type, the second control signal connector is for a second control signal of the first type, and the first and second control signal connectors are disposed in different areas of the surface. For example, the first type may be a chip select signal, a clock enable signal, or an on die termination enable signal.

摘要翻译： 在一个实施例中，半导体存储器件至少包括第一半导体存储器管芯，并且半导体存储器件的表面包括多个连接器。 多个连接器中的至少一个电连接到第一半导体存储器管芯。 多个连接器包括至少第一和第二控制信号连接器。 第一控制信号连接器用于第一类型的第一控制信号，第二控制信号连接器用于第一类型的第二控制信号，并且第一和第二控制信号连接器设置在表面的不同区域中。 例如，第一类型可以是芯片选择信号，时钟使能信号或芯片上终止使能信号。

公开(公告)号：US09546811B2

公开(公告)日：2017-01-17

申请号：US13613875

申请日：2012-09-13

申请人： Myung Ju Lee ,  Young Yun ,  Sung Cheol Kang

发明人： Myung Ju Lee ,  Young Yun ,  Sung Cheol Kang

IPC分类号： F25B49/00 ,  F25D29/00

CPC分类号： F25D29/00 ,  F25D2400/361 ,  F25D2500/06 ,  F25D2700/00 ,  F25D2700/08 ,  F25D2700/16

摘要： Disclosed herein is a refrigerator capable of varying a storage condition for food in accordance with a state of the food, thereby storing the food in a fresher state for a prolonged period of time. The refrigerator includes an indicating device to measure a state of food. The indicating device is provided to be portable, separately from a refrigerator body. The indicating device includes a measurement terminal, which come into contact with food, only when contact is needed. The refrigerator also includes an input unit to receive data about a state of food, a determination unit to determine a storage condition for the food, based on the input food state data, and a controller to control driving of the cooling device, based on the determined food storage condition. The indicating device includes a measurement unit to obtain food state data, and a display to display the food state data.

摘要翻译： 本文公开了一种能够根据食品的状态改变食物的储存条件的冰箱，从而将食物更长时间地储存在更新鲜的状态。 冰箱包括用于测量食物状态的指示装置。 指示装置被设置为便携式，与冰箱主体分离。 指示装置仅在需要接触时包括与食物接触的测量端子。 冰箱还包括输入单元，用于接收关于食物状态的数据，确定单元，用于基于所输入的食物状态数据来确定食物的储存条件;以及控制器，用于基于所述输入食物状态数据来控制所述冷却装置的驱动 确定食物储存条件。 指示装置包括获取食物状态数据的测量单元和显示食物状态数据的显示器。