发明申请
- 专利标题： BOARD MODULE AND METHOD OF MANUFACTURING SAME
- 专利标题（中）： 板模块及其制造方法
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申请号： US13063983申请日： 2009-06-02
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公开(公告)号： US20110169022A1公开(公告)日： 2011-07-14
- 发明人: Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
- 申请人： Motoji Shiota , Gen Nagaoka , Ichiro Umekawa , Yasuhiro Hida , Yukio Shimizu
- 申请人地址： JP Osaka-shi, Osaka
- 专利权人： SHARP KABUSHIKI KAISHA
- 当前专利权人： SHARP KABUSHIKI KAISHA
- 当前专利权人地址： JP Osaka-shi, Osaka
- 优先权： JP2008-251554 20080929
- 国际申请： PCT/JP2009/060092 WO 20090602
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L33/62 ; H01L21/60
摘要：
A liquid crystal display device (100) includes a glass substrate (110) having an LSI chip (130) and an FPC board (140) mounted thereon. A component ACF (150a) made of a single sheet is used to further mount discrete electronic components such as stabilizing capacitors (150) on the glass substrate (110). The component ACF (150a) has a size that covers not only a region where the discrete electronic components are to be mounted, but also the top surfaces of the LSI chip (130) and the FPC board (140) which are mounted first. By thus using the large component ACF (150a), a positional constraint upon adhering the component ACF (150a) to the glass substrate (110) is eliminated, reducing the area of a region where the discrete electronic components are mounted. By this, a board module miniaturized by reducing the area of a region where discrete electronic components are mounted is provided.
公开/授权文献
- US08450753B2 Board module and method of manufacturing same 公开/授权日：2013-05-28
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