发明申请
- 专利标题: METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- 专利标题(中): 制造半导体器件的方法
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申请号: US12980175申请日: 2010-12-28
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公开(公告)号: US20110169174A1公开(公告)日: 2011-07-14
- 发明人: Hyun Jung KIM
- 申请人: Hyun Jung KIM
- 申请人地址: KR Icheon
- 专利权人: Hynix Semiconductor Inc.
- 当前专利权人: Hynix Semiconductor Inc.
- 当前专利权人地址: KR Icheon
- 优先权: KR10-2010-0001660 20100108
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L21/28
摘要:
A method for forming a semiconductor device is disclosed. A method for forming a semiconductor device includes forming a first bit line contact over a semiconductor substrate, forming a second bit line contact that is coupled to the first bit line contact and has a larger width than the first bit line contact, and forming a bit line over the second bit line contact. When using the semiconductor device having a buried gate, although the bit line is formed to have a small width and the bit line pattern is misaligned, the method prevents incorrect coupling between a bit line and a bit line contact, so that it basically deteriorates unique characteristics of the semiconductor device.
公开/授权文献
- US08580669B2 Method for fabricating semiconductor device 公开/授权日:2013-11-12