发明申请
US20110169174A1 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 有权
制造半导体器件的方法

  • 专利标题: METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
  • 专利标题(中): 制造半导体器件的方法
  • 申请号: US12980175
    申请日: 2010-12-28
  • 公开(公告)号: US20110169174A1
    公开(公告)日: 2011-07-14
  • 发明人: Hyun Jung KIM
  • 申请人: Hyun Jung KIM
  • 申请人地址: KR Icheon
  • 专利权人: Hynix Semiconductor Inc.
  • 当前专利权人: Hynix Semiconductor Inc.
  • 当前专利权人地址: KR Icheon
  • 优先权: KR10-2010-0001660 20100108
  • 主分类号: H01L23/48
  • IPC分类号: H01L23/48 H01L21/28
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
摘要:
A method for forming a semiconductor device is disclosed. A method for forming a semiconductor device includes forming a first bit line contact over a semiconductor substrate, forming a second bit line contact that is coupled to the first bit line contact and has a larger width than the first bit line contact, and forming a bit line over the second bit line contact. When using the semiconductor device having a buried gate, although the bit line is formed to have a small width and the bit line pattern is misaligned, the method prevents incorrect coupling between a bit line and a bit line contact, so that it basically deteriorates unique characteristics of the semiconductor device.
公开/授权文献
信息查询
0/0