发明申请
- 专利标题： Integrated electronic device and method of making the same
- 专利标题（中）： 集成电子设备及其制作方法
-
申请号： US13064347申请日： 2011-03-21
-
公开(公告)号： US20110171806A1公开(公告)日： 2011-07-14
- 发明人: Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
- 申请人： Xiaoyu Mi , Yoshihiro Mizuno , Tsuyoshi Matsumoto , Hisao Okuda , Satoshi Ueda , Takeo Takahashi
- 申请人地址： JP Kawasaki JP Tokyo
- 专利权人： FUJITSU LIMITED,TAIYO YUDEN CO., LTD.
- 当前专利权人： FUJITSU LIMITED,TAIYO YUDEN CO., LTD.
- 当前专利权人地址： JP Kawasaki JP Tokyo
- 优先权： JP2005-252596 20050831
- 主分类号： H01L21/02
- IPC分类号： H01L21/02
摘要：
An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.
公开/授权文献
- US08518789B2 Integrated electronic device and method of making the same 公开/授权日：2013-08-27
信息查询
IPC分类:
