公开(公告)号：US08518789B2

公开(公告)日：2013-08-27

申请号：US13064347

申请日：2011-03-21

申请人： Xiaoyu Mi ,  Yoshihiro Mizuno ,  Tsuyoshi Matsumoto ,  Hisao Okuda ,  Satoshi Ueda ,  Takeo Takahashi

发明人： Xiaoyu Mi ,  Yoshihiro Mizuno ,  Tsuyoshi Matsumoto ,  Hisao Okuda ,  Satoshi Ueda ,  Takeo Takahashi

IPC分类号： H01L21/20

CPC分类号： H01L27/0688 ,  H01F17/0006 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

摘要翻译： 集成电子设备包括基板，无源部件，用于外部连接的焊盘和三维布线。 无源部件包括设置在基板上的多级线圈电感器。 多级线圈电感器具有多个以多层布置的线圈。 相互相邻的线圈线彼此间隔开。 三维布线包括在基板上延伸的第一布线部分，从基板延伸而沿着基板延伸的第二布线部分和与第一布线部分和第二布线部分连接的第三布线部分。

公开(公告)号：US07948056B2

公开(公告)日：2011-05-24

申请号：US11509577

申请日：2006-08-25

申请人： Xiaoyu Mi ,  Yoshihiro Mizuno ,  Tsuyoshi Matsumoto ,  Hisao Okuda ,  Satoshi Ueda ,  Takeo Takahashi

发明人： Xiaoyu Mi ,  Yoshihiro Mizuno ,  Tsuyoshi Matsumoto ,  Hisao Okuda ,  Satoshi Ueda ,  Takeo Takahashi

IPC分类号： H01L29/00

CPC分类号： H01L27/0688 ,  H01F17/0006 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

公开(公告)号：US20110171806A1

公开(公告)日：2011-07-14

申请号：US13064347

申请日：2011-03-21

申请人： Xiaoyu Mi ,  Yoshihiro Mizuno ,  Tsuyoshi Matsumoto ,  Hisao Okuda ,  Satoshi Ueda ,  Takeo Takahashi

发明人： Xiaoyu Mi ,  Yoshihiro Mizuno ,  Tsuyoshi Matsumoto ,  Hisao Okuda ,  Satoshi Ueda ,  Takeo Takahashi

IPC分类号： H01L21/02

CPC分类号： H01L27/0688 ,  H01F17/0006 ,  H01L23/5227 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

摘要： An integrated electronic device includes a substrate, passive components, pads for external connection, and three-dimensional wiring. The passive components includes a multi-stage coil inductor provided on the substrate. The multi-stage coil inductor has a plurality of coils disposed in several layers. Mutually adjacent coil wires are spaced-apart from each other. The three-dimensional wiring includes a first wiring portion which extends on the substrate, a second wiring portion which extends off the substrate but along the substrate, and a third wiring portion connecting with the first wiring portion and the second wiring portion.

摘要翻译： 集成电子设备包括基板，无源部件，用于外部连接的焊盘和三维布线。 无源部件包括设置在基板上的多级线圈电感器。 多级线圈电感器具有多个以多层布置的线圈。 相互相邻的线圈线彼此间隔开。 三维布线包括在基板上延伸的第一布线部分，从基板延伸而沿着基板延伸的第二布线部分和与第一布线部分和第二布线部分连接的第三布线部分。

公开(公告)号：US07551054B2

公开(公告)日：2009-06-23

申请号：US11288142

申请日：2005-11-29

申请人： Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Hiromitsu Soneda ,  Satoshi Ueda ,  Takeo Takahashi

发明人： Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Hiromitsu Soneda ,  Satoshi Ueda ,  Takeo Takahashi

IPC分类号： H01F5/00

CPC分类号： H01L23/5227 ,  H01F17/0006 ,  H01F27/40 ,  H01L21/84 ,  H01L23/5223 ,  H01L27/016 ,  H01L27/13 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19011 ,  H01L2924/00

摘要： An electronic device includes: an insulating substrate; at least one capacitor and an inductor that are formed directly on the insulating substrate; a line that connects the capacitor and the inductor from the above; and an external connecting pad unit that is made of the same conductor as the line and is disposed on the insulating substrate.

摘要翻译： 电子设备包括：绝缘基板; 至少一个直接形成在所述绝缘基板上的电容器和电感器; 从上述连接电容器和电感器的线路; 以及外部连接焊盘单元，其由与该线路相同的导体制成并且设置在绝缘基板上。

公开(公告)号：US20060114077A1

公开(公告)日：2006-06-01

申请号：US11288142

申请日：2005-11-29

申请人： Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Hiromitsu Soneda ,  Satoshi Ueda ,  Takeo Takahashi

发明人： Yoshihiro Mizuno ,  Xiaoyu Mi ,  Hisao Okuda ,  Hiromitsu Soneda ,  Satoshi Ueda ,  Takeo Takahashi

IPC分类号： H03H7/38

CPC分类号： H01L23/5227 ,  H01F17/0006 ,  H01F27/40 ,  H01L21/84 ,  H01L23/5223 ,  H01L27/016 ,  H01L27/13 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19011 ,  H01L2924/00

摘要： An electronic device includes: an insulating substrate; at least one capacitor and an inductor that are formed directly on the insulating substrate; a line that connects the capacitor and the inductor from the above; and an external connecting pad unit that is made of the same conductor as the line and is disposed on the insulating substrate.

公开(公告)号：US08259459B2

公开(公告)日：2012-09-04

申请号：US12239202

申请日：2008-09-26

申请人： Satoshi Ueda ,  Takeo Takahashi ,  Tsuyoshi Matsumoto ,  Tsuyoshi Yokoyama ,  Xiaoyu Mi

发明人： Satoshi Ueda ,  Takeo Takahashi ,  Tsuyoshi Matsumoto ,  Tsuyoshi Yokoyama ,  Xiaoyu Mi

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H05K1/0269 ,  H01F17/0013 ,  H01L23/544 ,  H01L23/645 ,  H01L27/016 ,  H01L28/10 ,  H01L2223/54426 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K1/165 ,  H05K2201/0391 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/2054 ,  H01L2924/00

摘要： An electronic device includes a substrate, a coil that has a spiral shape and is provided on the substrate, and a conductive pattern that is provided inside of the coil, has optical reflectivity higher than that of a surface of the coil, and is divided into pieces.

摘要翻译： 电子设备包括基板，具有螺旋形状并设置在基板上的线圈和设置在线圈内部的导电图案，其光学反射率高于线圈表面的光学反射率，并且被划分为 件

公开(公告)号：US20090085708A1

公开(公告)日：2009-04-02

申请号：US12238764

申请日：2008-09-26

申请人： Tsuyoshi MATSUMOTO ,  Xiaoyu Mi ,  Takeo Takahashi ,  Satoshi Ueda

发明人： Tsuyoshi MATSUMOTO ,  Xiaoyu Mi ,  Takeo Takahashi ,  Satoshi Ueda

IPC分类号： H01F5/00

CPC分类号： H01F17/0013

摘要： An electronic device includes a substrate, two ellipse spiral coils that are provided on the substrate, are spaced from each other in a longitudinal direction thereof, and are electrically connected to each other, two wires that are electrically connected to outermost circumference of the two coils respectively and extract the two coils to outside, and a connection portion that electrically connects each end of innermost circumference of the two coils. A ratio of inner diameter against outer diameter of the two coils in a long axis direction and in a short axis direction thereof is respectively 0.5 to 0.8.

摘要翻译： 电子设备包括基板，设置在基板上的两个椭圆螺旋线圈沿其纵向方向彼此间隔开，并且彼此电连接，两条电线与两个线圈的最外周电连接 分别将两个线圈提取到外部，以及连接部，其将两个线圈的最内周的各端电连接。 两个线圈的内径与外径的长轴方向和短轴方向的比分别为0.5〜0.8。

公开(公告)号：US20090085707A1

公开(公告)日：2009-04-02

申请号：US12237826

申请日：2008-09-25

申请人： Xiaoyu MI ,  Takeo Takahashi ,  Tsuyoshi Matsumoto ,  Satoshi Ueda

发明人： Xiaoyu MI ,  Takeo Takahashi ,  Tsuyoshi Matsumoto ,  Satoshi Ueda

IPC分类号： H01F5/00

CPC分类号： H01F17/0013 ,  H01F27/29 ,  H01F2017/002 ,  H01F2017/0073

摘要： An electronic device includes a substrate, a first coil that has a spiral shape and is provided on the substrate, a second coil that has a spiral shape, is provided above the first coil, and is spaced from the first coil, a first connection portion that electrically couples the first coil and the second coil, a wire that is provided on the substrate and connects one of the first coil and the second coil to outside, and a second connection portion that is mechanically connected to an outer side face of outermost circumference of the second coil and is mechanically connected on the substrate where one of the wire and the first coil is not provided.

摘要翻译： 一种电子设备包括基板，具有螺旋形状并设置在基板上的第一线圈，具有螺旋形状的第二线圈，设置在第一线圈上方，并与第一线圈间隔开，第一连接部分 将第一线圈和第二线圈电耦合的线路，设置在基板上并将第一线圈和第二线圈中的一个连接到外部的线，以及机械地连接到最外侧的外侧面的第二连接部 并且机械连接在不设置线和第一线圈中的一个的基板上。

公开(公告)号：US20090213561A1

公开(公告)日：2009-08-27

申请号：US12391843

申请日：2009-02-24

申请人： Xiaoyu Mi ,  Takeo Takahashi ,  Satoshi Ueda ,  Tatsuya Kakehashi ,  Hidehiko Ishiguro ,  Shinya Yamamoto

发明人： Xiaoyu Mi ,  Takeo Takahashi ,  Satoshi Ueda ,  Tatsuya Kakehashi ,  Hidehiko Ishiguro ,  Shinya Yamamoto

IPC分类号： H05K7/00

CPC分类号： H01L23/645 ,  H01L25/165 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05599

摘要： An electronic device includes an insulative substrate, a spiral inductor formed by an interconnection layer provided on a first surface of the insulative layer, a first chip that is mounted on a second surface of the insulative layer opposite to the first surface and is electrically connected to a passive circuit including the spiral inductor, the first chip having an electrically conductive substrate, and a first protrusion that is provided on one of the first and second surface of the insulative substrate and protrudes therefrom, the first protrusion being electrically connected to one of the passive circuit and the first chip to an external circuit.

摘要翻译： 电子器件包括绝缘衬底，由设置在绝缘层的第一表面上的互连层形成的螺旋电感器，安装在与第一表面相对的绝缘层的第二表面上的第一芯片，并且电连接到 包括所述螺旋电感器的无源电路，所述第一芯片具有导电基板，以及设置在所述绝缘基板的所述第一表面和所述第二表面中的一个上并从其突出的第一突起，所述第一突起电连接到 无源电路和第一芯片到外部电路。

公开(公告)号：US08221962B2

公开(公告)日：2012-07-17

申请号：US12343935

申请日：2008-12-24

申请人： Takeo Takahashi ,  Xiaoyu Mi ,  Tsuyoshi Yokoyama ,  Satoshi Ueda

发明人： Takeo Takahashi ,  Xiaoyu Mi ,  Tsuyoshi Yokoyama ,  Satoshi Ueda

IPC分类号： G03F7/26

CPC分类号： H05K1/16 ,  H01F41/041 ,  H01L25/16 ,  H01L2224/11 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/19015 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/165 ,  H05K3/0023 ,  H05K3/108 ,  H05K3/388 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688 ,  H01L2924/00

摘要： A method of manufacturing an electronic device includes forming a photosensitive SOG oxide layer on a multi-layer ceramics substrate having a penetrating electrode, forming an opening by subjecting the photosensitive SOG oxide layer to an exposure treatment and developing treatment so that an upper face of the penetrating electrode is exposed, and forming a passive element on the photosensitive SOG oxide layer, the passive element being connected to the penetrating electrode through the opening.

摘要翻译： 一种制造电子器件的方法包括在具有穿透电极的多层陶瓷衬底上形成感光性SOG氧化物层，通过使感光性SOG氧化物层进行曝光处理和显影处理，形成开口，从而使 暴露穿透电极，并在感光SOG氧化物层上形成无源元件，无源元件通过开口连接到穿透电极。