发明申请
- 专利标题： OPTIMIZED LID ATTACH PROCESS FOR THERMAL MANAGEMENT AND MULTI-SURFACE COMPLIANT HEAT REMOVAL
- 专利标题（中）： 用于热管理和多表面合格热去除的优化附件过程
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申请号： US13075803申请日： 2011-03-30
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公开(公告)号： US20110177656A1公开(公告)日： 2011-07-21
- 发明人: Vadim Gektin , Deviprasad Malladi
- 申请人： Vadim Gektin , Deviprasad Malladi
- 申请人地址： US CA Redwood City
- 专利权人： ORACLE INTERNATIONAL CORPORATION
- 当前专利权人： ORACLE INTERNATIONAL CORPORATION
- 当前专利权人地址： US CA Redwood City
- 主分类号： H01L21/50
- IPC分类号： H01L21/50
摘要：
A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device; applying non-adhesive film to the one or more components; identifying a primary component of the one or more components; and applying phase change material on each of the one or more components other than the primary component. The phase change material is placed on top of the non-adhesive film. The process further includes placing the heat rejecting device on the corresponding one or more components; and removing the heat rejecting device from the corresponding one or more components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device; removing the non-adhesive film from the heat rejecting device; placing a heatsink-attach thermal interface material on the one or more components; and placing the heat rejecting device on the corresponding one or more components.
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