公开(公告)号：US08283204B2

公开(公告)日：2012-10-09

申请号：US13075803

申请日：2011-03-30

申请人： Vadim Gektin ,  Deviprasad Malladi

发明人： Vadim Gektin ,  Deviprasad Malladi

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/42 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16195

摘要： A multi-surface compliant heat removal process that includes identifying components to share a heat rejecting device; applying non-adhesive film to the components; identifying a primary component of the components; and applying phase change material on each of the components, other than the primary component. The phase change material is placed on top of the non-adhesive film. The process also includes placing the heat rejecting device on the corresponding components and removing the heat rejecting device from the corresponding components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device; removing the non-adhesive film from the heat rejecting device; placing a heatsink-attach thermal interface material on the components; and placing the heat rejecting device on the corresponding components.

摘要翻译： 一种多表面兼容的散热过程，其包括识别部件以共享散热装置; 将非粘合膜施加到部件上; 识别组件的主要组件; 并且将相变材料施加到除主要部件之外的每个部件上。 相变材料放置在非粘合膜的顶部。 该方法还包括将散热装置放置在相应的部件上，并从相应的部件移除散热装置。 相变材料和非粘合膜保留在散热装置上。 该方法还包括在排热装置上回流相变材料; 从散热装置中除去非粘合膜; 将散热片附着的热界面材料放置在部件上; 并将散热装置放置在相应的部件上。

公开(公告)号：US06727193B2

公开(公告)日：2004-04-27

申请号：US10093669

申请日：2002-03-08

申请人： Vadim Gektin ,  Deviprasad Malladi

发明人： Vadim Gektin ,  Deviprasad Malladi

IPC分类号： H01L2126

CPC分类号： H01L23/433 ,  H01L23/3735 ,  H01L29/51 ,  H01L2924/0002 ,  H01L2924/00

摘要： Novel methods and apparatus to enhance thermal performance of IC packages are disclosed. In an embodiment, a method of enhancing thermal uniformity across a semiconductor device is disclosed. The method includes providing the semiconductor device. The semiconductor device has a plurality of thermal regions. A first thermal region of the plurality of thermal regions has a different temperature than a second thermal region of the plurality of thermal regions. The method further provides a thermal enhancement material substantially adjacent to the first and second thermal regions. In another embodiment, a thermal conductivity of the thermal enhancement material is adjusted in relation to a temperature effecting the thermal enhancement material.

摘要翻译： 公开了提高IC封装热性能的新方法和装置。 在一个实施例中，公开了一种提高半导体器件的热均匀性的方法。 该方法包括提供半导体器件。 半导体器件具有多个热区域。 多个热区域的第一热区域具有与多个热区域中的第二热区域不同的温度。 该方法还提供了基本上与第一和第二热区域相邻的热增强材料。 在另一个实施例中，相对于影响热增强材料的温度调节热增强材料的热导率。

公开(公告)号：US06637506B2

公开(公告)日：2003-10-28

申请号：US10093643

申请日：2002-03-08

申请人： Vadim Gektin ,  Deviprasad Malladi

发明人： Vadim Gektin ,  Deviprasad Malladi

IPC分类号： H05K720

CPC分类号： F28F23/00 ,  F28F2013/006 ,  H01L23/433 ,  H01L24/32 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/00

摘要： In an embodiment, an apparatus for enhancing a thermal match between portions of a semiconductor device is disclosed. The apparatus includes a die and a heat spreader. The heat spreader is in thermal contact with the die. The heat spreader has a center portion and a perimeter portion. The center portion and the perimeter portions are structurally coupled to each other. In another embodiment, the perimeter portion of the heat spreader is selected from material with a lower CTE than the material for the center portion of the heat spreader.

摘要翻译： 在一个实施例中，公开了一种用于增强半导体器件的部分之间的热匹配的装置。 该装置包括模具和散热器。 散热器与模具热接触。 散热器具有中心部分和周边部分。 中心部分和周边部分在结构上彼此耦合。 在另一个实施例中，散热器的周边部分选自具有比散热器的中心部分的材料更低的CTE的材料。

公开(公告)号：US07939364B2

公开(公告)日：2011-05-10

申请号：US12121337

申请日：2008-05-15

申请人： Vadim Gektin ,  Deviprasad Malladi

发明人： Vadim Gektin ,  Deviprasad Malladi

IPC分类号： H01L21/00

CPC分类号： H01L23/42 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16195

摘要： A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device, applying non-adhesive film to the one or more components, identifying a primary component of the one or more components, and applying phase change material on each of the one or more components other than the primary component. The phase change material is placed on top of the non-adhesive film. The process further includes placing the heat rejecting device on the corresponding one or more components and removing the heat rejecting device from the corresponding one or more components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device, removing the non-adhesive film from the heat rejecting device, placing a heatsink-attach thermal interface material on the one or more components, and placing the heat rejecting device on the corresponding one or more components.

摘要翻译： 多表面兼容的热去除方法包括：识别一个或多个部件以共享热拒绝装置，将非粘合膜施加到所述一个或多个部件，识别所述一个或多个部件的主要部件，以及施加相变材料 在除主要部件之外的一个或多个部件的每一个上。 相变材料放置在非粘合膜的顶部。 该方法还包括将散热装置放置在相应的一个或多个部件上，并从相应的一个或多个部件移除散热装置。 相变材料和非粘合膜保留在散热装置上。 该方法还包括在排热装置上回流相变材料，从热排出装置中去除非粘合膜，将散热器附着的热界面材料放置在一个或多个部件上，将散热装置放置在 对应的一个或多个组件。

公开(公告)号：US07301227B1

公开(公告)日：2007-11-27

申请号：US11207630

申请日：2005-08-19

申请人： Vadim Gektin ,  Deviprasad Malladi

发明人： Vadim Gektin ,  Deviprasad Malladi

IPC分类号： H01L23/02 ,  H01L23/48

CPC分类号： H01L23/4006 ,  H01L23/04 ,  H01L23/3675 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/32245 ,  H01L2924/16152

摘要： A package for an integrated circuit (IC) die comprises a substrate and a lid. The substrate has an upper surface facing an interior of the package and a lower surface facing an exterior of the package. The upper surface of the substrate carries an IC die and provides electrical connections from the IC die to the lower surface of the substrate. The lid includes an outer lid and an inner lid. The inner lid is positioned over the IC die and is in thermal communication with the IC die. The inner lid is formed of a material suitable for conducting heat away from the IC die. The outer lid is attached to the upper surface of the substrate. A gap extends between the outer lid and inner lid.

摘要翻译： 用于集成电路（IC）管芯的封装包括衬底和盖子。 衬底具有面向封装内部的上表面和面向封装外部的下表面。 衬底的上表面承载IC管芯并且提供从IC管芯到衬底的下表面的电连接。 盖子包括外盖和内盖。 内盖位于IC芯片上方并与IC芯片热连通。 内盖由适于从IC芯片传导热量的材料形成。 外盖附接到基板的上表面。 间隙在外盖和内盖之间延伸。

公开(公告)号：US20110177656A1

公开(公告)日：2011-07-21

申请号：US13075803

申请日：2011-03-30

申请人： Vadim Gektin ,  Deviprasad Malladi

发明人： Vadim Gektin ,  Deviprasad Malladi

IPC分类号： H01L21/50

CPC分类号： H01L23/42 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16195

摘要： A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device; applying non-adhesive film to the one or more components; identifying a primary component of the one or more components; and applying phase change material on each of the one or more components other than the primary component. The phase change material is placed on top of the non-adhesive film. The process further includes placing the heat rejecting device on the corresponding one or more components; and removing the heat rejecting device from the corresponding one or more components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device; removing the non-adhesive film from the heat rejecting device; placing a heatsink-attach thermal interface material on the one or more components; and placing the heat rejecting device on the corresponding one or more components.

摘要翻译： 多表面兼容的散热过程包括：识别一个或多个部件以共享散热装置; 将非粘合膜施加到所述一种或多种组分; 识别所述一个或多个组件的主要组件; 以及将相变材料施加到除主要部件之外的一个或多个部件的每一个上。 相变材料放置在非粘合膜的顶部。 该方法还包括将散热装置放置在相应的一个或多个部件上; 以及从相应的一个或多个部件移除所述散热装置。 相变材料和非粘合膜保留在散热装置上。 该方法还包括在排热装置上回流相变材料; 从散热装置中除去非粘合膜; 将散热器附着的热界面材料放置在所述一个或多个部件上; 以及将所述散热装置放置在相应的一个或多个部件上。

公开(公告)号：US20090286359A1

公开(公告)日：2009-11-19

申请号：US12121337

申请日：2008-05-15

申请人： Vadim Gektin ,  Deviprasad Malladi

发明人： Vadim Gektin ,  Deviprasad Malladi

IPC分类号： H01L21/50

CPC分类号： H01L23/42 ,  H01L23/4275 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/16195

摘要： A multi-surface compliant heat removal process includes: identifying one or more components to share a heat rejecting device; applying non-adhesive film to the one or more components; identifying a primary component of the one or more components; and applying phase change material on each of the one or more components other than the primary component. The phase change material is placed on top of the non-adhesive film. The process further includes placing the heat rejecting device on the corresponding one or more components; and removing the heat rejecting device from the corresponding one or more components. The phase change material and the non-adhesive film remain with the heat rejecting device. The process also includes reflowing the phase change material on the heat rejecting device; removing the non-adhesive film from the heat rejecting device; placing a heatsink-attach thermal interface material on the one or more components; and placing the heat rejecting device on the corresponding one or more components.

摘要翻译： 多表面兼容的散热过程包括：识别一个或多个部件以共享散热装置; 将非粘合膜施加到所述一种或多种组分; 识别所述一个或多个组件的主要组件; 以及将相变材料施加到除主要部件之外的一个或多个部件的每一个上。 相变材料放置在非粘合膜的顶部。 该方法还包括将散热装置放置在相应的一个或多个部件上; 以及从相应的一个或多个部件移除所述散热装置。 相变材料和非粘合膜保留在散热装置上。 该方法还包括在排热装置上回流相变材料; 从散热装置中除去非粘合膜; 将散热器附着的热界面材料放置在所述一个或多个部件上; 以及将所述散热装置放置在相应的一个或多个部件上。

公开(公告)号：US20120153453A1

公开(公告)日：2012-06-21

申请号：US12971737

申请日：2010-12-17

申请人： Seshasayee Ankireddi ,  Vadim Gektin ,  James A. Jones ,  Margaret B. Stern

发明人： Seshasayee Ankireddi ,  Vadim Gektin ,  James A. Jones ,  Margaret B. Stern

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/3675 ,  H01L21/50 ,  H01L23/42 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/0345 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/0508 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27334 ,  H01L2224/27849 ,  H01L2224/29109 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75755 ,  H01L2224/75756 ,  H01L2224/83011 ,  H01L2224/83013 ,  H01L2224/83014 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83211 ,  H01L2224/83815 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16171 ,  H01L2924/16251 ,  H01L2924/16747 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01023 ,  H01L2924/00012 ,  H01L2924/01032

摘要： A method for the assembly of a semiconductor package that includes cleaning a surface of a chip and a surface of a heat removal device by reverse sputtering is given. The method includes sequentially coating the surface of the chip and the surface of the heat removal device with an adhesive layer, a barrier layer, and a protective layer over a target joining area. The chip and the heat removal device are placed into carrier fixtures and preheated to a target temperature. Then a metallic thermal interface material (TIM) preform is mechanically rolled onto the surface of the chip and the first and the second carrier fixtures are attached together such that the metallic TIM layer on the surface of the chip is joined to the coated surface of the heat removal device through a fluxless process. The method includes heating the joined carrier fixtures in a reflow oven.

摘要翻译： 给出了一种用于组装半导体封装的方法，其包括通过反溅射清洗芯片的表面和散热装置的表面。 该方法包括在目标接合区域上用粘合剂层，阻挡层和保护层依次涂覆芯片的表面和除热装置的表面。 将芯片和散热装置放置在载体夹具中并预热至目标温度。 然后将金属热界面材料（TIM）预成型件机械地轧制到芯片的表面上，并且将第一和第二载体固定装置附接在一起，使得芯片表面上的金属TIM层结合到 散热装置通过无助焊剂工艺。 该方法包括在回流炉中加热接合的载体夹具。

公开(公告)号：US08767391B2

公开(公告)日：2014-07-01

申请号：US13595777

申请日：2012-08-27

申请人： Youlin Jin ,  Jiye Xu ,  Vadim Gektin

发明人： Youlin Jin ,  Jiye Xu ,  Vadim Gektin

IPC分类号： H05K7/20 ,  A47B77/08 ,  H05K5/00

CPC分类号： H05K7/20563

摘要： A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.

摘要翻译： 一种底架，其包括：槽，其构造成接收具有挡板位置销和安装在其上的电子部件的印刷电路板;安装在所述槽内的引导机构，以及可移动地安装在所述槽内且由所述引导机构朝向狭槽开口偏压的滑架， 所述托架包括适于操纵通过所述槽的空气流的挡板，所述托架被构造成当所述印刷电路被驱动时被所述挡板位置销从所述槽开口驱动并相对于所述印刷电路板上的所述电子部件定向 板被加载到槽中，使得挡板将空气流引导到电子部件上。

公开(公告)号：US08331094B2

公开(公告)日：2012-12-11

申请号：US13012078

申请日：2011-01-24

申请人： Seshasayee Ankireddi ,  Vadim Gektin

发明人： Seshasayee Ankireddi ,  Vadim Gektin

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/48

CPC分类号： H01L23/367 ,  H01L23/427 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10515 ,  H05K2201/2036

摘要： A stacked microprocessor package architecture includes one or more microprocessor packages, the microprocessor packages including one or more microprocessor die disposed on a substrate, a satellite die, a thermal bus thermally coupled to the microprocessor die and thermally connected to system cooling, and a power bus providing power to the microprocessor die and coupled to system power. The microprocessor packages may include a module cap providing mechanical protection and/or thermal isolation or a thermal cooling path for stacked modules. Variable height standoffs provide signal connection from substrates of the stacked microprocessor packages to a system board.

摘要翻译： 堆叠的微处理器封装结构包括一个或多个微处理器封装，微处理器封装包括设置在基板上的一个或多个微处理器管芯，卫星管芯，热耦合到微处理器管芯并热连接到系统冷却的热总线，以及电源总线 向微处理器提供电源并连接到系统电源。 微处理器封装可以包括为层叠模块提供机械保护和/或热隔离或热冷却路径的模块盖。 可变高度支座提供从堆叠的微处理器封装的基板到系统板的信号连接。