According to one aspect, the invention provides a method of providing conductive structures between two foils in a multi-foil system. The system comprises at least two foils, from which at least one foil comprises a terminal. The method comprises the steps of (in any order) providing at least one solid state adhesive layer, patterning adhesive layer with through-holes; filling the through-holes with conductive material, so as to form the conductive structure, connected to the terminal; and bonding the at least two foils.One advantage of the invention is that it may be used in a manufacturing process for multi-foil systems.