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1.发明授权Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate 有权用于在柔性基板上组装电气部件的方法和装置以及具有柔性基板的电气部件的组装公开(公告)号：US09338894B2
公开(公告)日：2016-05-10
申请号：US13990823
申请日：2011-12-02
CPC分类号： H05K3/32 , H01L23/4985 , H01L24/24 , H01L24/76 , H01L24/82 , H01L2224/2405 , H01L2224/24051 , H01L2224/24226 , H01L2224/25171 , H01L2224/25175 , H01L2224/76155 , H01L2224/76261 , H01L2224/766 , H01L2224/767 , H01L2224/82102 , H01L2224/82104 , H01L2224/82106 , H01L2224/82874 , H01L2224/9202 , H01L2224/92144 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0283 , H05K1/189 , H05K3/12 , H05K3/305 , H05K2201/10674 , H05K2203/107 , H05K2203/1469 , H05K2203/1545 , H05K2203/175 , Y10T29/49133 , Y10T29/53178 , H01L2924/00
摘要： A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of placing the component (30) on a first main side (11) of the substrate, applying a machine vision step to estimate a position of the electric contacts, depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, calculating partitioning lines depending on the estimated position of the electric contacts, partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method.In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.
摘要翻译： 提出了一种用于将组件（30）与柔性基板（10）组装的方法，该部件具有电触点（31）。 该方法包括以下步骤：将组件（30）放置在衬底的第一主侧（11）上，施加机器视觉步骤以估计电触点的位置，沉积导电的一个或多个层（32） 材料或其前体，所述层在由所述部件限定的衬底的区域上延伸到横向超过所述区域，根据所述电触点的估计位置计算划分线，通过局部将所述层划分为相互绝缘的区域（32d） 沿着所述分隔线从所述层去除材料。 还提出了适合于执行该方法的装置。 此外，存在可以通过根据本发明的方法和装置获得的组件。
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公开(公告)号：US08980025B2
公开(公告)日：2015-03-17
申请号：US13511472
申请日：2010-11-01
申请人： Jeroen Van Den Brand , Sander Christiaan Broers , Milan Saalmink , Andreas Heinrich Dietzel , Andreas Tanda
发明人： Jeroen Van Den Brand , Sander Christiaan Broers , Milan Saalmink , Andreas Heinrich Dietzel , Andreas Tanda
CPC分类号： B32B37/0046 , B32B37/10 , B32B37/1009 , B32B38/1841 , B32B2309/68 , Y10T156/1028 , Y10T156/1304 , Y10T156/133 , Y10T156/1335 , Y10T156/1702 , Y10T156/1734
摘要： An apparatus is provided for laminating a first and a second sheet (1, 2) comprising—a chamber (10) having a first, a second and a third compartment (11, 12, 13 resp.) subsequently arranged along a first axis (Z), each compartment having a port (21, 22, 23 resp.)—a first sheet carrier (40) arranged transverse to said first axis (Z) and being displaceable along said first axis (Z),—a second sheet carrier (50) arranged in a plane aligned with and opposite the first sheet carrier (40), the second sheet carrier being displaceable and/or rotatable in said plane,—a first flexible membrane (42) extending laterally to a wall of the chamber, the first sheet carrier (40) and/or the first flexible membrane (42) separating the first and the second compartment (11, 12) of the chamber (10) from each other,—a second flexible membrane (52) extending laterally from the second sheet carrier (50) to the wall of the chamber, the second sheet carrier (50) and the second flexible membrane (52) separating the second and the third compartment (12, 13) of the chamber (10) from each other,—an alignment facility (60) for aligning the second sheet (2) relative to the first sheet (1) by moving the second sheet carrier (50) in a direction transverse to the first axis (Z) and/or rotating the second sheet carrier around an axis parallel to the first axis (Z).
摘要翻译： 提供了一种用于层压第一和第二片材（1,2）的装置，所述第一片材和第二片材（1,2）包括 - 具有随后沿第一轴线布置的第一，第二和第三隔室（11,12,13）的腔室（10） Z），每个隔室具有端口（21,22,23） - 横向于所述第一轴线（Z）布置并可沿着所述第一轴线（Z）移位的第一片材载体（40）， - 第二片材载体 （50），布置在与所述第一片状载体（40）对准并相对的平面中，所述第二片状载体在所述平面内是可移动的和/或可旋转的， - 第一柔性膜（42）横向延伸到所述腔室的壁， 将所述腔室（10）的第一和第二隔室（11,12）彼此分开的第一片状载体（40）和/或第一柔性膜（42）， - 第二柔性膜（52） 第二片载体（50）到腔室的壁，第二片载体（50）和第二柔性膜（52）sep 将所述腔室（10）的第二和第三隔室（12,13）彼此相对， - 对准设备（60），用于通过移动所述第二片材（2）来相对于所述第一片材（1）对准所述第二片材 载体（50）在横向于第一轴线（Z）的方向上和/或使第二片材载体围绕平行于第一轴线（Z）的轴线旋转。
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公开(公告)号：US08749522B2
公开(公告)日：2014-06-10
申请号：US12676621
申请日：2008-09-09
摘要： An optical sensor for measuring a force distribution includes a substrate, one or more light emitting sources, and one or more detectors provided on the substrate, with the detectors responsive to the light emitted by the sources. A deformable opto-mechanical layer is also provided on the substrate with light responsive properties depending on a deformation of the opto-mechanical layer. The design of the sensor and particularly the use of optical components in a deformable layer make it possible to measure the contact force accurately, including in some embodiments, the direction of the contact force. The sensor is scalable and adaptable to complex shapes.
摘要翻译： 用于测量力分布的光学传感器包括衬底，一个或多个发光源和设置在衬底上的一个或多个检测器，其中检测器响应于源发射的光。 基于光机械层的变形，还可以在基板上提供具有光响应特性的可变形的光机械层。 传感器的设计，特别是可变形层中的光学部件的使用使得可以精确地测量接触力，包括在一些实施例中，接触力的方向。 传感器是可扩展的，适用于复杂的形状。
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公开(公告)号：US20110159683A1
公开(公告)日：2011-06-30
申请号：US13054277
申请日：2009-07-14
IPC分类号： H01L21/768
CPC分类号： H05K3/107 , H05K1/183 , H05K3/0026 , H05K3/1258 , H05K2201/09036 , H05K2203/0264
摘要： The invention relates to a method of forming a high density structure comprising the steps of providing a substrate (2) wherein the high density structure is to be formed with a release liner (3), said release liner being self-removable; forming at least one cavity (5a, 5b) in the substrate through the release liner, said at least one cavity forming at least a part of the high density structure; at least partially filling the at least one cavity with a filler material (7a, 7b); sintering the thus formed structure; removing the release liner from the substrate (2).
摘要翻译： 本发明涉及一种形成高密度结构的方法，包括以下步骤：提供其中高密度结构将与剥离衬垫（3）形成的基底（2），所述释放衬垫是可自行移除的; 通过所述释放衬垫在所述衬底中形成至少一个空腔（5a，5b），所述至少一个空腔形成所述高密度结构的至少一部分; 用填充材料（7a，7b）至少部分地填充所述至少一个空腔; 烧结由此形成的结构; 从衬底（2）上移除释放衬垫。
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公开(公告)号：US09174425B2
公开(公告)日：2015-11-03
申请号：US13512004
申请日：2010-11-19
CPC分类号： B32B38/1841 , H01L51/0024 , H01L51/56 , Y10T156/10
摘要： The invention relates to an apparatus for laminating a first and a second sheet with a plane carrier (10) and a drum shaped carrier (20) for carrying a respective sheet. The apparatus has a first main operational mode wherein the drum shaped carrier (20) is at distance from a first carrier surface (12) of the plane carrier (10) in said third direction (Z), and a second main operational mode wherein the drum shaped carrier (20) is close to first carrier surface to bring the first and the second sheet (1, 2) in contact with each other. In the first main operational mode the drum shaped carrier (20) is virtually rolled over the first carrier surface (12) and the sheets are mutually aligned. In the second operational mode the sheets are laminated.
摘要翻译： 本发明涉及一种用于层压第一和第二片材的装置，其具有用于承载相应片材的平面托架（10）和鼓形托架（20）。 该装置具有第一主操作模式，其中鼓形载体（20）在所述第三方向（Z）处距平面载体（10）的第一载体表面（12）的距离处，以及第二主操作模式，其中， 鼓形载体（20）靠近第一载体表面以使第一和第二片材（1,2）彼此接触。 在第一主要操作模式中，鼓形托架（20）被虚拟地滚动在第一载体表面（12）上并且片材相互对准。 在第二操作模式中，片材被层压。
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6.发明申请METHOD AND APPARATUS FOR ASSEMBLING ELECTRIC COMPONENTS ON A FLEXIBLE SUBSTRATE AS WELL AS ASSEMBLY OF AN ELECTRIC COMPONENT WITH A FLEXIBLE SUBSTRATE 有权用于组装柔性基板上的电气部件的方法和装置，以便组装具有柔性基板的电气部件公开(公告)号：US20140069697A1
公开(公告)日：2014-03-13
申请号：US13990823
申请日：2011-12-02
CPC分类号： H05K3/32 , H01L23/4985 , H01L24/24 , H01L24/76 , H01L24/82 , H01L2224/2405 , H01L2224/24051 , H01L2224/24226 , H01L2224/25171 , H01L2224/25175 , H01L2224/76155 , H01L2224/76261 , H01L2224/766 , H01L2224/767 , H01L2224/82102 , H01L2224/82104 , H01L2224/82106 , H01L2224/82874 , H01L2224/9202 , H01L2224/92144 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0106 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K1/0283 , H05K1/189 , H05K3/12 , H05K3/305 , H05K2201/10674 , H05K2203/107 , H05K2203/1469 , H05K2203/1545 , H05K2203/175 , Y10T29/49133 , Y10T29/53178 , H01L2924/00
摘要： A method is presented for assembling a component (30) with a flexible substrate (10), the component having electric contacts (31). The method comprises the steps of placing the component (30) on a first main side (11) of the substrate, applying a machine vision step to estimate a position of the electric contacts, depositing one or more layers (32) of an electrically conductive material or a precursor thereof, said layer extending over an area of the substrate defined by the component to laterally beyond said area, calculating partitioning lines depending on the estimated position of the electric contacts, partitioning the layer into mutually insulated areas (32d) by locally removing material from said layer along said partitioning lines. Also an apparatus is presented that is suitable for carrying out the method.In addition an assembly is present that can be obtained by the method and the apparatus according to the invention.
摘要翻译： 提出了一种用于将组件（30）与柔性基板（10）组装的方法，该部件具有电触点（31）。 该方法包括以下步骤：将组件（30）放置在衬底的第一主侧（11）上，施加机器视觉步骤以估计电触点的位置，沉积导电的一个或多个层（32） 材料或其前体，所述层在由所述部件限定的衬底的区域上延伸到横向超过所述区域，根据所述电触点的估计位置计算划分线，通过局部将所述层划分为相互绝缘的区域（32d） 沿着所述分隔线从所述层去除材料。 还提出了适合于执行该方法的装置。 此外，存在可以通过根据本发明的方法和装置获得的组件。
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公开(公告)号：US20120305163A1
公开(公告)日：2012-12-06
申请号：US13512004
申请日：2010-11-19
CPC分类号： B32B38/1841 , H01L51/0024 , H01L51/56 , Y10T156/10
摘要： The invention relates to an apparatus for laminating a first and a second sheet with a plane carrier (10) and a drum shaped carrier (20) for carrying a respective sheet. The apparatus has a first main operational mode wherein the drum shaped carrier (20) is at distance from a first carrier surface (12) of the plane carrier (10) in said third direction (Z), and a second main operational mode wherein the drum shaped carrier (20) is close to first carrier surface to bring the first and the second sheet (1, 2) in contact with each other. In the first main operational mode the drum shaped carrier (20) is virtually rolled over the first carrier surface (12) and the sheets are mutually aligned. In the second operational mode the sheets are laminated.
摘要翻译： 本发明涉及一种用于层压第一和第二片材的装置，其具有用于承载相应片材的平面托架（10）和鼓形托架（20）。 该装置具有第一主操作模式，其中鼓形载体（20）在所述第三方向（Z）处距平面载体（10）的第一载体表面（12）的距离处，以及第二主操作模式，其中， 鼓形载体（20）靠近第一载体表面以使第一和第二片材（1,2）彼此接触。 在第一主要操作模式中，鼓形托架（20）被虚拟地滚动在第一载体表面（12）上并且片材相互对准。 在第二操作模式中，片材被层压。
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8.发明申请Method of providing conductive structures in a multi-foil system and multifoil system comprising same 审中-公开在多箔系统中提供导电结构的方法和包括其的多系统系统公开(公告)号：US20110180206A1
公开(公告)日：2011-07-28
申请号：US13001024
申请日：2009-07-01
CPC分类号： H05K3/361 , H05K3/0035 , H05K3/321 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/462 , H05K2201/058 , H05K2201/09727 , H05K2201/09845 , H05K2201/10977 , H05K2203/063 , Y10T156/1056
摘要： According to one aspect, the invention provides a method of providing conductive structures between two foils in a multi-foil system. The system comprises at least two foils, from which at least one foil comprises a terminal. The method comprises the steps of (in any order) providing at least one solid state adhesive layer, patterning adhesive layer with through-holes; filling the through-holes with conductive material, so as to form the conductive structure, connected to the terminal; and bonding the at least two foils.One advantage of the invention is that it may be used in a manufacturing process for multi-foil systems.
摘要翻译： 根据一个方面，本发明提供了一种在多箔系统中在两个箔之间提供导电结构的方法。 该系统包括至少两个箔，至少一个箔包括一个端子。 该方法包括以下步骤（以任何顺序）提供至少一个固态粘合剂层，图案化具有通孔的粘合剂层; 用导电材料填充通孔，以形成连接到端子的导电结构; 以及接合所述至少两个箔。 本发明的一个优点是可以用于多箔系统的制造过程中。
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公开(公告)号：US10575411B2
公开(公告)日：2020-02-25
申请号：US13001024
申请日：2009-07-01
IPC分类号： H05K3/36
摘要： According to one aspect, the invention provides a method of providing conductive structures between two foils in a multi-foil system. The system comprises at least two foils, from which at least one foil comprises a terminal. The method comprises the steps of (in any order) providing at least one solid state adhesive layer, patterning adhesive layer with through-holes; filling the through-holes with conductive material, so as to form the conductive structure, connected to the terminal; and bonding the at least two foils.One advantage of the invention is that it may be used in a manufacturing process for multi-foil systems.
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公开(公告)号：US08759884B2
公开(公告)日：2014-06-24
申请号：US13002981
申请日：2009-07-07
申请人： Jeroen van den Brand , Andreas Heinrich Dietzel , Edward Willem Albert Young , Herbert Lifka , Erik Dekempeneer
发明人： Jeroen van den Brand , Andreas Heinrich Dietzel , Edward Willem Albert Young , Herbert Lifka , Erik Dekempeneer
IPC分类号： H01L29/20
CPC分类号： H01L27/3202 , H01L27/3204 , H01L51/0024 , H01L51/448 , H01L51/5203 , H01L51/524 , H01L2251/5361
摘要： An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer.The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).
摘要翻译： 电子设备包括功能堆叠（10）和通过绝缘粘合剂层（30）与其耦合的盖（50）。 功能堆叠（10）包括第一透明和导电层（22），第二导电层（24）和功能结构（26），其包括夹在所述第一和第二导电层之间的至少一层。 盖（50）包括衬底（52）和布置在粘合剂层（28）和衬底（52）之间的第一平面中的至少第一导电结构（66,68）。 横向于第一平面（61）的第一和第二横向电导体（32,34）将第一和第二导电层（22,24）与第一和第二导电结构（66,68）在第一和第二导电结构 平面（61）。
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