发明申请
- 专利标题： SILVER-CONTAINING POWDER, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE USING THE SAME, AND PLASTIC SUBSTRATE
- 专利标题（中）： 含铅粉末，其制造方法，使用其的导电浆料和塑料基材
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申请号： US12737220申请日： 2009-06-10
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公开(公告)号： US20110180764A1公开(公告)日： 2011-07-28
- 发明人: Akeo Takahashi , Kaori Kawamura , Seung Taeg Lee , Ren-Hun Jin , Koichiro Matsuki , Tomoyo Kajii
- 申请人： Akeo Takahashi , Kaori Kawamura , Seung Taeg Lee , Ren-Hun Jin , Koichiro Matsuki , Tomoyo Kajii
- 申请人地址： JP Tokyo
- 专利权人： DIC Corporation
- 当前专利权人： DIC Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2008-167262 20080626; JP2008-288651 20081111; JP2009-071732 20090324
- 国际申请： PCT/JP2009/060587 WO 20090610
- 主分类号： H01B1/22
- IPC分类号： H01B1/22 ; B82Y30/00
摘要：
The present invention relates to powder containing silver nanoparticles having an average particle size of 2 to 50 nm in an amount of 95% or more by mass and to applications of the powder. Silver-containing powder containing the silver nanoparticles is obtained by reducing a silver compound in the presence of a compound obtained by bonding polyethylene glycol to polyethyleneimine having a certain molecular weight and then by performing a concentration step and a drying step. A plastic substrate is obtained by directly applying a conductive paste that uses the powder on a plastic substrate and by performing drying.
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