发明申请
US20110183279A1 SUBSTRATE HEATING APPARATUS, SUBSTRATE HEATING METHOD AND SUBSTRATE PROCESSING SYSTEM
审中-公开
基板加热装置，基板加热方法和基板加工系统
- 专利标题： SUBSTRATE HEATING APPARATUS, SUBSTRATE HEATING METHOD AND SUBSTRATE PROCESSING SYSTEM
- 专利标题（中）： 基板加热装置，基板加热方法和基板加工系统
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申请号： US13014111申请日： 2011-01-26
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公开(公告)号： US20110183279A1公开(公告)日： 2011-07-28
- 发明人: Tomoya OKUBO , Masaki SUGIYAMA
- 申请人： Tomoya OKUBO , Masaki SUGIYAMA
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-015600 20100127
- 主分类号： F27D1/00
- IPC分类号： F27D1/00
摘要：
A substrate heating apparatus includes a container configured to be maintained in a depressurized state; and a substrate mounting table having a plurality of substrate support pins on its upper surface. The substrate mounting table is configured to mount a substrate while providing a gap between the upper surface of the substrate mounting table and the substrate. The substrate heating apparatus further includes a heater configured to heat the substrate through the substrate mounting table; a pressure regulator configured to regulate a pressure in the container; a temperature controller configured to control an output of the heater so as to control a temperature of the substrate mounting table; and a pressure controller configured to control the pressure regulator so as to control the pressure in the container.
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