发明申请
- 专利标题： Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
- 专利标题（中）： 半导体衬底，层叠芯片封装，半导体板及其制造方法
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申请号： US12656458申请日： 2010-01-29
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公开(公告)号： US20110186985A1公开(公告)日： 2011-08-04
- 发明人: Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
- 申请人： Yoshitaka Sasaki , Hiroyuki Ito , Atsushi Iijima
- 申请人地址： US CA Milpitas CN Hong Kong
- 专利权人： HEADWAY TECHNOLOGIES, INC.,SAE MAGNETICS (H.K.) LTD.
- 当前专利权人： HEADWAY TECHNOLOGIES, INC.,SAE MAGNETICS (H.K.) LTD.
- 当前专利权人地址： US CA Milpitas CN Hong Kong
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/28 ; H01L21/768 ; H01L21/50
摘要：
A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged within the unit region. Further, the plurality of groove portions have a wide-port structure in which a wide width portion wider in width than a groove lower portion including a bottom portion is formed at an inlet port thereof.
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