- 专利标题: Micro-Fluidic Injection Molded Solder (IMS)
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申请号: US13088727申请日: 2011-04-18
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公开(公告)号: US20110192887A1公开(公告)日: 2011-08-11
- 发明人: Stephen L. Buchwalter , Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
- 申请人: Stephen L. Buchwalter , Peter A. Gruber , Paul A. Lauro , Jae-Woong Nah
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: B23K1/20
- IPC分类号: B23K1/20
摘要:
A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.
公开/授权文献
- US08136714B2 Micro-fluidic injection molded solder (IMS) 公开/授权日:2012-03-20
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