发明申请
- 专利标题： SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE
- 专利标题（中）： 半导体器件，芯片安装结构，制造半导体器件的方法，以及形成芯片安装结构的方法
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申请号： US13018723申请日： 2011-02-01
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公开(公告)号： US20110193223A1公开(公告)日： 2011-08-11
- 发明人: Hiroshi Ozaki , Hiroshi Asami
- 申请人： Hiroshi Ozaki , Hiroshi Asami
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-026484 20100209
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/60
摘要：
A semiconductor device includes: a semiconductor chip having a semiconductor substrate; a pad electrode formed on the semiconductor substrate; a base metal layer formed on said pad electrode; and a bump electrode formed on the base metal layer, in which an exposed surface including a side surface of the base metal layer is covered with the solder bump electrode.
信息查询
IPC分类:
