公开(公告)号：US11598977B2

公开(公告)日：2023-03-07

申请号：US16648766

申请日：2018-09-19

申请人： Hiroshi Asami ,  Yasunori Izawa

发明人： Hiroshi Asami ,  Yasunori Izawa

IPC分类号： G02C7/02 ,  G02C7/06

摘要： A lens, system for designing, computer program for designing and a method for designing, with a computer, a progressive addition lens including a distance vision region, a near vision region, and an intermediate vision region, wherein a power gradually changes between the distance vision region and the near vision region, and wherein the progressive addition lens is based on prescription data, the method including: determining a transmission astigmatic performance parameter corresponding to a sum of a prescribed astigmatism included in the prescription data and of a predetermined amount of extra astigmatism; determining lens surface data corresponding to the determined transmission performance parameter.

公开(公告)号：US20220244570A1

公开(公告)日：2022-08-04

申请号：US17724113

申请日：2022-04-19

申请人： Hiroshi ASAMI ,  Yasunori IZAWA

发明人： Hiroshi ASAMI ,  Yasunori IZAWA

IPC分类号： G02C7/06 ,  G02C7/02

摘要： A lens, system for designing, computer program for designing and a method for designing, with a computer, a progressive addition lens including a distance vision region, a near vision region, and an intermediate vision region, wherein a power gradually changes between the distance vision region and the near vision region, and wherein the progressive addition lens is based on prescription data, the method including: determining a transmission astigmatic performance parameter corresponding to a sum of a prescribed astigmatism included in the prescription data and of a predetermined amount of extra astigmatism; determining lens surface data corresponding to the determined transmission performance parameter.

公开(公告)号：US10401649B2

公开(公告)日：2019-09-03

申请号：US15576262

申请日：2016-05-26

申请人： HOYA LENS THAILAND LTD. ,  Hiroshi Asami ,  Ayumu Ito

发明人： Hiroshi Asami ,  Ayumu Ito

IPC分类号： G02C7/02 ,  G02C7/06

摘要： When an addition power at a position corresponding to a fitting point within a prescription addition power is greater than a target addition power set according to a target distance, the target addition power is set as an addition power between a progression-start point and a progression-end point on a principal meridian, and in addition the average gradient of an addition power between the progression-start point and the fitting point is set to differ from an average gradient of an addition power between the fitting point and the progression-end point. When the addition power at the position corresponding to the fitting point within the prescription addition power is equal to or smaller than the target addition power, a gradient of the addition power is made constant in a partial region including at least the fitting point between the progression-start point and the progression-end point on the principal meridian.

公开(公告)号：US20180149883A1

公开(公告)日：2018-05-31

申请号：US15576266

申请日：2016-05-26

申请人： Hiroshi ASAMI ,  Ayumu ITO ,  HOYA LENS THAILAND LTD.

发明人： Hiroshi ASAMI ,  Ayumu ITO

IPC分类号： G02C7/02 ,  G02C7/06 ,  G06F17/50

CPC分类号： G02C7/027 ,  G02C7/025 ,  G02C7/06 ,  G02C7/061 ,  G02C7/065 ,  G06F17/50 ,  G06F17/5009 ,  G06F2217/16 ,  Y02E60/76 ,  Y04S40/22

摘要： A vision simulation, on assumption that spectacles are worn, is performed for a first model designed by setting a target additional power of a desirable value at a position corresponding to a fitting point on a principal meridian. A correction amount is computed for correcting the difference between a simulation value obtained for the additional power at the position corresponding to the fitting point on the principal meridian through the vision simulation and the target additional power. A second model is designed by replacing the additional power with a value obtained by the addition of the calculated correction amount to the target additional power.

公开(公告)号：US20120286387A1

公开(公告)日：2012-11-15

申请号：US13553389

申请日：2012-07-19

申请人： Yoshihiro Nabe ,  Hiroshi Asami ,  Yuji Takaoka ,  Yoshimichi Harada

发明人： Yoshihiro Nabe ,  Hiroshi Asami ,  Yuji Takaoka ,  Yoshimichi Harada

IPC分类号： H01L31/0224

CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L27/14634 ,  H01L27/14636 ,  H01L31/0224 ,  H01L2224/02372 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2224/1134 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/30105 ,  H01L2924/351 ,  H01L2924/014 ,  H01L2224/05552 ,  H01L2924/00

摘要： A semiconductor device including a semiconductor substrate having oppositely facing first and second surfaces, the first surface being an active surface and provided with an electronic element thereon, a pad electrode to be connected to the electronic element in a peripheral portion of the electronic element on the active surface, a first opening extending from the second surface toward the pad electrode so as not to reach the first surface of the semiconductor substrate, a second opening formed to reach the pad electrode from a bottom surface of the first opening and having a diameter smaller than that of the first opening, an insulating layer formed to cover sidewall surfaces of the first opening and the second opening, and a conductive layer formed, inside of the insulating layer, to cover at least an inner wall surface of the insulating layer and a bottom surface of the second opening.

摘要翻译： 一种半导体器件，包括具有相对面对的第一表面和第二表面的半导体衬底，所述第一表面是活性表面，并且在其上设置有电子元件，焊接电极，用于在所述电子元件的周边部分中连接到所述电子元件， 活性表面，从第二表面朝向焊盘电极延伸以便不到达半导体衬底的第一表面的第一开口，形成为从第一开口的底表面到达焊盘电极并具有较小直径的第二开口 形成为覆盖第一开口和第二开口的侧壁表面的绝缘层和在绝缘层内部形成的导电层，以覆盖至少绝缘层的内壁表面和 第二开口的底面。

公开(公告)号：US07728431B2

公开(公告)日：2010-06-01

申请号：US11810070

申请日：2007-06-04

申请人： Yoshimichi Harada ,  Akiyoshi Aoyagi ,  Hiroshi Asami

发明人： Yoshimichi Harada ,  Akiyoshi Aoyagi ,  Hiroshi Asami

IPC分类号： H01L23/48

CPC分类号： H01L24/11 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/12 ,  H01L2224/02126 ,  H01L2224/02255 ,  H01L2224/03019 ,  H01L2224/0401 ,  H01L2224/05018 ,  H01L2224/05027 ,  H01L2224/05082 ,  H01L2224/0555 ,  H01L2224/05552 ,  H01L2224/05556 ,  H01L2224/05557 ,  H01L2224/05558 ,  H01L2224/05559 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13007 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： Herein disclosed an electronic component having a passivation layer in which an opening that exposes a part of a pad electrode is formed, an underlying metal layer formed on the pad electrode and the passivation layer, and a barrier metal layer formed on the underlying metal layer for an external connection electrode, the electronic component including a recess or/and a projection configured to be provided under the barrier metal layer outside or/and inside the opening, the underlying metal layer being formed on the recess or/and the projection and having a surface shape that follows the recess or/and the projection.

摘要翻译： 这里公开了一种具有钝化层的电子部件，其中形成有露出焊盘电极的一部分的开口，形成在焊盘电极和钝化层上的下面的金属层以及形成在下面的金属层上的阻挡金属层 外部连接电极，所述电子部件包括凹部或/和突出部，所述突起构造成设置在所述阻挡金属层的下方或/或所述开口内侧，所述下部金属层形成在所述凹部或/和所述突起上，并且具有 跟随凹部或/和突起的表面形状。

公开(公告)号：US07421777B2

公开(公告)日：2008-09-09

申请号：US11063131

申请日：2005-02-22

申请人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuki Nishitani ,  Ken Orui

发明人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuki Nishitani ,  Ken Orui

IPC分类号： H05K3/36

CPC分类号： H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： The present invention provides a method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiring substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

摘要翻译： 本发明提供一种制造多层布线基板的方法，其可以以细间距保持导体图案的尺寸稳定性，从材料选择的角度解决对工艺的限制，并且进一步降低制造成本，并且 多层布线基板。 形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。 在第二布线基板的层叠之后，最后蚀刻并去除支撑片。 第二布线基板仅堆叠在第一布线基板上需要多层的部分上，从而减少第二布线基板的结构材料的量。

公开(公告)号：US07288724B2

公开(公告)日：2007-10-30

申请号：US10403550

申请日：2003-03-31

申请人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

发明人： Hiroshi Asami ,  Hidetoshi Kusano ,  Yuji Nishitani ,  Ken Orui

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC分类号： H05K3/4694 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/0023 ,  H05K3/205 ,  H05K3/4617 ,  H05K3/4623 ,  H05K2201/0195 ,  H05K2201/09536 ,  H05K2201/09881 ,  H05K2201/09972 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

摘要： A method of manufacturing a multilayer wiring substrate, which can preserve the dimensional stability of a conductor pattern at a fine pitch, solve the restriction on a process from the viewpoint of material selection, and further reduce a manufacturing cost, and a multilayer wiring substrate. A second wiring substrate formed on a supporting sheet made of metal and an adhesive layer are partially stacked on a predetermined region of a first wiring substrate by using the supporting sheet. After the lamination of the second wiring substrate, the supporting sheet is finally etched and removed. The second wiling substrate is stacked only on the portion required to be multilayered on the first wiring substrate to thereby reduce the amount of the construction material of the second wiring substrate.

摘要翻译： 制造可以以细间距保持导体图案的尺寸稳定性的多层布线基板的方法从材料选择的角度解决了对工艺的限制，并且进一步降低了制造成本，以及多层布线基板。 形成在由金属制成的支撑片和粘合剂层上的第二布线基板通过使用支撑片部分堆叠在第一布线基板的预定区域上。 在第二布线基板的层叠之后，最后蚀刻并去除支撑片。 第二卷绕基板仅叠层在第一布线基板上的多层的部分上，从而减少第二布线基板的结构材料的量。

公开(公告)号：US07053315B2

公开(公告)日：2006-05-30

申请号：US10802188

申请日：2004-03-17

申请人： Ken Orui ,  Hiroko Jinno ,  Yuji Nishitani ,  Hiroshi Asami

发明人： Ken Orui ,  Hiroko Jinno ,  Yuji Nishitani ,  Hiroshi Asami

IPC分类号： H05K1/11 ,  H01R12/04

CPC分类号： H05K3/3452 ,  H01L2224/10126 ,  H05K3/3478 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0594 ,  Y10T29/49147

摘要： To provide a junction structure and a junction method for conductive projection advantageous in that a required reinforcement strength can be obtained while suppressing the amount of a reinforcing resin material supplied to prevent warpage due to curing shrinkage. A conductive projection is joined to the surface of a conductor portion formed at the same level as that of the surface of the insulating layer so that a root portion of the projection is surrounded by a fillet-form resin material. The resin material contains an activator which assists in the junction between the conductive projection and the conductor portion when the resin material is in an uncured state, and is fused by heating to wet and rise the root portion of the conductive projection so as to be in a fillet form. The resin material is cured by an ultraviolet light while excluding the resin material on the conductor portion.

摘要翻译： 提供一种用于导电突起的接合结构和接合方法，其优点在于可以获得所需的增强强度，同时抑制供应的增强树脂材料的量以防止由于固化收缩引起的翘曲。 导电突起与形成在与绝缘层的表面相同水平面的导体部分的表面接合，使得突起的根部被圆角状的树脂材料包围。 树脂材料含有活化剂，当树脂材料处于未固化状态时，其有助于导电突起与导体部分之间的接合，并通过加热熔化并使导电突起的根部上升，使其处于 一个圆角形状。 树脂材料通过紫外线固化，同时排除导体部分上的树脂材料。

公开(公告)号：US5590533A

公开(公告)日：1997-01-07

申请号：US479114

申请日：1995-06-07

申请人： Hiroshi Asami ,  Mitsuru Suzuki

发明人： Hiroshi Asami ,  Mitsuru Suzuki

IPC分类号： F17C3/08 ,  F25B9/14 ,  F28D17/00 ,  H01F6/00 ,  F25B9/00

CPC分类号： F25B9/14 ,  F17C3/085 ,  F28D17/005 ,  H01F6/00 ,  F25B2309/003

摘要： A refrigerator with a regenerator is provided which is supported by a holder. The refrigerator has a cylinder having an inner circumferential surface matching a circular tube shape, a displacer being disposed in the cylinder and forming an expansion space near at one end of the inside of the cylinder, a groove pattern having a groove formed along the direction intersecting the axial direction of the displacer, the groove allowing a gas flowing through a gap between the cylinder and displacer from one end to the other end of the outer circumferential surface of the displacer to positively heat-exchange with the cylinder and displacer, and a main gas passage for supplying gas to the expansion space of the cylinder and recovering the gas from the expansion space. The holder supports the refrigerator so that the axial direction of the cylinder is directed in the vertical direction and the expansion space is formed at the upper end of the inside of the cylinder, or the axial direction of the cylinder is directed in an oblique direction relative to the vertical direction.

摘要翻译： 提供具有再生器的冰箱，其由保持器支撑。 冰箱具有圆筒状的圆筒状，圆筒状的内周面配置有位于圆筒内侧的膨胀空间的排水器，沿着与圆筒形状相交的方向形成有槽的槽图形， 排出器的轴向方向，槽允许气体从排出器的外周表面的一端到另一端流过气缸和置换器之间的间隙，以与气缸和置换器积极地热交换，主体 气体通道，用于向气缸的膨胀空间供应气体并从膨胀空间回收气体。 支架支撑冰箱，使得气缸的轴向在垂直方向上被引导，并且膨胀空间形成在气缸内部的上端，或者气缸的轴向方向相对于倾斜方向 到垂直方向。