Invention Application
US20110198111A1 FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
有权
FLEX-RIGID接线板及其制造方法
- Patent Title: FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): FLEX-RIGID接线板及其制造方法
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Application No.: US12948882Application Date: 2010-11-18
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Publication No.: US20110198111A1Publication Date: 2011-08-18
- Inventor: Nobuyuki Naganuma , Michimasa Takahashi , Masakazu Aoyama
- Applicant: Nobuyuki Naganuma , Michimasa Takahashi , Masakazu Aoyama
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Main IPC: H05K1/14
- IPC: H05K1/14 ; C09J5/00
Abstract:
A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.
Public/Granted literature
- US08759687B2 Flex-rigid wiring board and method for manufacturing the same Public/Granted day:2014-06-24
Information query
