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公开(公告)号：US08404978B2
公开(公告)日：2013-03-26
申请号：US12873944
申请日：2010-09-01
IPC分类号： H05K1/03
CPC分类号： H05K3/4691 , H05K2201/0391 , H05K2201/09127 , H05K2201/09854 , H05K2203/308 , Y10T29/49124
摘要： A flex-rigid wiring board including an insulative substrate having a wiring layer which is formed on the insulative substrate and includes a conductor, a flexible wiring board positioned beside the insulative substrate and having a wiring layer, the wiring layer of the flexible wiring board including a conductor and being contained inside the flexible wiring board, and a first insulation layer positioned on the insulative substrate and the flexible wiring board such that a portion of the flexible wiring board is left exposed from the first insulation layer. The first insulation layer has a wiring layer which is formed on the first insulation layer and includes a conductor. The wiring layer of the first insulation layer has a thickness which is formed thicker than a thickness of the wiring layer of the flexible wiring board and a thickness of the wiring layer of the insulative substrate.
摘要翻译： 一种柔性刚性布线板，包括具有布线层的绝缘基板，所述布线层形成在所述绝缘基板上并且包括导体，柔性布线板位于所述绝缘基板的旁边并具有布线层，所述柔性布线板的布线层包括 导体，并且被容纳在柔性布线板内部;以及第一绝缘层，其位于绝缘基板和柔性布线板上，使得柔性布线板的一部分从第一绝缘层露出。 第一绝缘层具有形成在第一绝缘层上并包括导体的布线层。 第一绝缘层的布线层的厚度比柔性布线基板的布线层的厚度和绝缘基板的布线层的厚度厚。
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公开(公告)号：US08493747B2
公开(公告)日：2013-07-23
申请号：US12949078
申请日：2010-11-18
IPC分类号： H05K1/11
CPC分类号： H05K3/4691 , H05K2201/09827 , H05K2201/09845 , Y10T29/49124 , Y10T29/49128
摘要： A flex-rigid wiring board including an insulative substrate, a flexible wiring board positioned beside the insulative substrate, an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing a portion of the flexible wiring board, and a wiring layer made of a conductor and formed on the insulation layer. The insulation layer has a tapered portion which becomes thinner toward an end surface of the insulation layer in the direction of the portion of the flexible wiring board exposed by the insulation layer. The wiring layer has a sloping portion formed on the tapered portion of the insulation layer.
摘要翻译： 一种柔性刚性布线板，包括绝缘基板，位于绝缘基板旁边的柔性布线板，位于绝缘基板和柔性布线板之上的绝缘层，并使柔性布线板的一部分露出，并且布线层由 导体并形成在绝缘层上。 绝缘层具有锥形部分，其在由绝缘层暴露的柔性线路板的部分的方向上朝向绝缘层的端面变薄。 布线层具有形成在绝缘层的锥形部分上的倾斜部分。
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公开(公告)号：US08461459B2
公开(公告)日：2013-06-11
申请号：US12894777
申请日：2010-09-30
IPC分类号： H05K1/00
CPC分类号： H05K3/4691 , H05K2201/09127 , H05K2201/09536 , H05K2203/308 , Y10T29/49124
摘要： A flex-rigid wiring board includes an insulative substrate, a flexible connected body positioned beside the insulative substrate and including multiple flexible wiring boards, and an insulation layer positioned over the insulative substrate and the flexible connected body and having a portion exposing a portion of the flexible connected body. The flexible wiring boards include a double-sided flexible wiring board having a conductive layer on one surface of the double-sided flexible wiring board and a conductive layer on the opposite surface of the double-sided flexible wiring board. The flexible connected body has a conductor on one side of the flexible connected body, a conductor on the opposite side of the flexible connected body, and a through-hole conductor electrically connecting the conductors of the flexible connected body. The through-hole conductor is penetrating from one side through the opposite side of the flexible wiring boards.
摘要翻译： 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性连接体，并且包括多个柔性布线板，以及位于绝缘基板和柔性连接体上方的绝缘层，并且具有暴露一部分 柔性连接体。 柔性布线板包括双面柔性布线板，该双面柔性布线板在双面柔性布线板的一个表面上具有导电层，在双面柔性布线板的相对表面上具有导电层。 柔性连接体在柔性连接体的一侧具有导体，在柔性连接体的相对侧上具有导体，以及电连接柔性连接体的导体的通孔导体。 通孔导体从一侧穿过柔性布线板的相对侧。
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公开(公告)号：US20110198111A1
公开(公告)日：2011-08-18
申请号：US12948882
申请日：2010-11-18
CPC分类号： H05K3/4691 , H05K2201/0715 , H05K2201/09145 , H05K2201/09154 , H05K2201/09827 , H05K2201/09845
摘要： A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.
摘要翻译： 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性布线板以及位于绝缘基板和柔性布线板上方的绝缘层，并露出柔性布线板的至少一部分。 柔性布线板具有在位于绝缘基板旁边的柔性布线板的端部处朝向绝缘基板制成的锥形部分。
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公开(公告)号：US08759687B2
公开(公告)日：2014-06-24
申请号：US12948882
申请日：2010-11-18
IPC分类号： H05K1/03
CPC分类号： H05K3/4691 , H05K2201/0715 , H05K2201/09145 , H05K2201/09154 , H05K2201/09827 , H05K2201/09845
摘要： A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.
摘要翻译： 柔性刚性布线板包括绝缘基板，位于绝缘基板旁边的柔性布线板以及位于绝缘基板和柔性布线板上方的绝缘层，并露出柔性布线板的至少一部分。 柔性布线板具有在位于绝缘基板旁边的柔性布线板的端部处朝向绝缘基板制成的锥形部分。
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公开(公告)号：US08658904B2
公开(公告)日：2014-02-25
申请号：US12914064
申请日：2010-10-28
IPC分类号： H05K1/03
CPC分类号： H05K3/4691 , H05K1/025 , H05K1/115 , H05K1/185 , H05K3/4053 , H05K3/429 , H05K3/4614 , H05K2201/0191 , H05K2201/09563 , H05K2201/096 , H05K2201/09745
摘要： A flex-rigid wiring board including a flexible wiring board, a first insulation layer positioned to a side of the flexible board and having a first hole through the first layer, a second insulation layer over the first layer and an end portion of the flexible board and with a second hole through the second layer along the axis of the first hole, a third insulation layer over the first layer and the end portion of the flexible board on the opposite side of the second layer and with a third hole through the third layer along the axis of the first hole, a first structure having a filled conductor in the first hole, a second structure having a filled conductor in the second hole along the axis of the first structure, and a third structure having a filled conductor in the third hole along the axis of the first structure.
摘要翻译： 一种挠性刚性布线板，包括柔性布线板，位于所述柔性板的一侧的第一绝缘层，并且具有穿过所述第一层的第一孔，所述第一层上的第二绝缘层和所述柔性板的端部 并且沿着第一孔的轴线穿过第二层的第二孔，在第二层的相对侧的第一层和柔性板的端部之上的第三绝缘层和穿过第三层的第三孔 沿着第一孔的轴线，具有在第一孔中的填充导体的第一结构，具有沿着第一结构的轴线的第二孔中的填充导体的第二结构，以及在第三孔中具有填充导体的第三结构 孔沿着第一结构的轴线。
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公开(公告)号：US08569630B2
公开(公告)日：2013-10-29
申请号：US12914378
申请日：2010-10-28
CPC分类号： H05K3/4691 , H05K2201/09527 , H05K2201/096
摘要： A flex-rigid wiring board having a flexible wiring board, a first insulation layer positioned adjacent to a side of the flexible board and having a first hole which penetrates through the first layer, a second insulation layer laminated over the flexible board and the first layer and having a second hole which penetrates through the second layer, the second hole of the second layer being formed along the axis of the first hole of the first layer, a first conductor structure formed in the first hole and including a filled conductor formed by filling plating in the first hole, and a second conductor structure formed in the second hole and including a filled conductor formed by filling plating in the second hole, the second conductor structure being formed along the axis of the first conductor structure and electrically connected to the first conductor structure.
摘要翻译： 一种具有柔性布线板的挠性刚性布线板，与柔性板的一侧相邻并且具有穿过第一层的第一孔的第一绝缘层，层压在柔性板上的第二绝缘层和第一层 并且具有穿过所述第二层的第二孔，所述第二层的第二孔沿着所述第一层的第一孔的轴线形成，形成在所述第一孔中的第一导体结构，所述第一导体结构包括填充导体， 电镀在第一孔中，第二导体结构形成在第二孔中，并且包括通过在第二孔中填充电镀形成的填充导体，第二导体结构沿着第一导体结构的轴线形成并电连接到第一孔 导体结构。
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公开(公告)号：US20110194262A1
公开(公告)日：2011-08-11
申请号：US12949078
申请日：2010-11-18
IPC分类号： H05K1/00
CPC分类号： H05K3/4691 , H05K2201/09827 , H05K2201/09845 , Y10T29/49124 , Y10T29/49128
摘要： A flex-rigid wiring board including an insulative substrate, a flexible wiring board positioned beside the insulative substrate, an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing a portion of the flexible wiring board, and a wiring layer made of a conductor and formed on the insulation layer. The insulation layer has a tapered portion which becomes thinner toward an end surface of the insulation layer in the direction of the portion of the flexible wiring board exposed by the insulation layer. The wiring layer has a sloping portion formed on the tapered portion of the insulation layer.
摘要翻译： 一种柔性刚性布线板，包括绝缘基板，位于绝缘基板旁边的柔性布线板，位于绝缘基板和柔性布线板之上的绝缘层，并使柔性布线板的一部分露出，并且布线层由 导体，形成在绝缘层上。 绝缘层具有锥形部分，其在由绝缘层暴露的柔性线路板的部分的方向上朝向绝缘层的端面变薄。 布线层具有形成在绝缘层的锥形部分上的倾斜部分。
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公开(公告)号：US20110180908A1
公开(公告)日：2011-07-28
申请号：US12895126
申请日：2010-09-30
CPC分类号： H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/5383 , H05K1/0298 , H05K1/092 , H05K1/116 , H05K1/18 , H05K3/0011 , H05K3/0094 , H05K3/4069 , H05K3/4611 , H05K3/4623 , H05K2201/09545 , H05K2201/09563 , H05K2201/096 , H05K2201/09854 , Y10T156/1056
摘要： A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other.
摘要翻译： 布线板包括具有第一表面和第二表面并且包括第一，第二和第三绝缘层从第一表面朝向第二表面的顺序的层叠体。 第一绝缘层具有穿过第一绝缘层的第一孔，并且包括在第一孔中由电镀制成的第一导体。 第二绝缘层具有穿过第二绝缘层的第二孔，并且包括在第二孔中由导电膏制成的第二导体。 第三绝缘层具有穿过第三绝缘层的第三孔，并且包括在第三孔中由电镀制成的第三导体。 第一，第二和第三导体沿着相同的轴定位并且彼此电连续。
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公开(公告)号：US08933556B2
公开(公告)日：2015-01-13
申请号：US12895126
申请日：2010-09-30
IPC分类号： H01L23/053 , H01L23/12 , H05K1/11 , H05K3/46 , H05K3/40
CPC分类号： H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/5383 , H05K1/0298 , H05K1/092 , H05K1/116 , H05K1/18 , H05K3/0011 , H05K3/0094 , H05K3/4069 , H05K3/4611 , H05K3/4623 , H05K2201/09545 , H05K2201/09563 , H05K2201/096 , H05K2201/09854 , Y10T156/1056
摘要： A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other.
摘要翻译： 布线板包括具有第一表面和第二表面并且包括第一，第二和第三绝缘层从第一表面朝向第二表面的顺序的层叠体。 第一绝缘层具有穿过第一绝缘层的第一孔，并且包括在第一孔中由电镀制成的第一导体。 第二绝缘层具有穿过第二绝缘层的第二孔，并且包括在第二孔中由导电膏制成的第二导体。 第三绝缘层具有穿过第三绝缘层的第三孔，并且包括在第三孔中由电镀制成的第三导体。 第一，第二和第三导体沿着相同的轴定位并且彼此电连续。
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