发明申请
US20110201207A1 BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES
审中-公开
解决方案处理电子设备的背板结构
- 专利标题： BACKPLANE STRUCTURES FOR SOLUTION PROCESSED ELECTRONIC DEVICES
- 专利标题（中）： 解决方案处理电子设备的背板结构
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申请号： US13077176申请日： 2011-03-31
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公开(公告)号： US20110201207A1公开(公告)日： 2011-08-18
- 发明人: Yaw-Ming A. Tsai , Matthew Stainer
- 申请人： Yaw-Ming A. Tsai , Matthew Stainer
- 申请人地址： US DE Wilmington
- 专利权人： E. I. DU PONT DE NEMOURS AND COMPANY
- 当前专利权人： E. I. DU PONT DE NEMOURS AND COMPANY
- 当前专利权人地址： US DE Wilmington
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; G03F7/20
摘要：
There is provided a backplane for an organic electronic device. The backplane has a TFT substrate; a multiplicity of electrode structures; and a bank structure defining a multiplicity of pixel openings on the electrode structures. The bank structure has a height adjacent to the pixel opening, hA, and a height removed from the pixel opening, hR, and hA is significantly less than hR.
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