发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS
- 专利标题（中）： 半导体器件和电子设备
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申请号： US13100398申请日： 2011-05-04
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公开(公告)号： US20110204487A1公开(公告)日： 2011-08-25
- 发明人: TAKAHIRO NAKANO , MASAKI UTSUMI , HIKARI SANO
- 申请人： TAKAHIRO NAKANO , MASAKI UTSUMI , HIKARI SANO
- 申请人地址： JP Osaka
- 专利权人： PANASONIC CORPORATION
- 当前专利权人： PANASONIC CORPORATION
- 当前专利权人地址： JP Osaka
- 优先权： JP2008-299443 20081125; JP2008-333133 20081226
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor device includes: a semiconductor substrate; a through electrode passing through the semiconductor substrate in a thickness direction of the semiconductor substrate; an internal electrode provided in a part of the top surface of the semiconductor substrate and electrically connected to the through electrode which reaches the part; a first protective film covering the top surface except a part of the internal electrode; a second protective film formed apart from the first protective film, on the part of the internal electrode, the part being not covered by the first protective film; and metal wiring formed on the back surface of the semiconductor substrate and electrically connected to the through electrode, the second main surface being on a side of the semiconductor substrate opposite the first main surface.
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