发明申请
US20110212557A1 METHOD OF MANUFACTURING AN ARRAY SUBSTRATE FOR LCD DEVICE HAVING DOUBLE-LAYERED METAL STRUCTURE
有权
具有双层金属结构的液晶显示装置制造阵列基板的方法
- 专利标题: METHOD OF MANUFACTURING AN ARRAY SUBSTRATE FOR LCD DEVICE HAVING DOUBLE-LAYERED METAL STRUCTURE
- 专利标题(中): 具有双层金属结构的液晶显示装置制造阵列基板的方法
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申请号: US13100883申请日: 2011-05-04
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公开(公告)号: US20110212557A1公开(公告)日: 2011-09-01
- 发明人: Won-Ho CHO , Gyoo-Chul Jo , Gue-Tai Lee , Jin-Gyu Kang , Beung-Hwa Jeong , Jin-Young Kim
- 申请人: Won-Ho CHO , Gyoo-Chul Jo , Gue-Tai Lee , Jin-Gyu Kang , Beung-Hwa Jeong , Jin-Young Kim
- 优先权: KR2003-0043946 20030630
- 主分类号: H01L33/62
- IPC分类号: H01L33/62
摘要:
The present invention is an array substrate for use in a liquid crystal display device, which includes a gate electrode, a gate line and a gate pad on a substrate, wherein the gate electrode, the gate line and the gate pad have a double-layered structure consisting of a first metal layer and a first barrier metal layer in series from the substrate, and wherein the first metal is one of aluminum and aluminum alloy; a gate insulation layer on the substrate covering the gate electrode, gate line and gate pad; an active layer and an ohmic contact layer sequentially formed on the gate insulation layer and over the gate electrode; a data line on the gate insulation layer perpendicularly crossing the gate line, source and drain electrodes contacting the ohmic contact layer, and a data pad on the gate insulation layer, wherein the data line, the source and drain electrode and the data pad have a double-layered structure consisting of a second barrier metal layer and a second metal layer of copper; a passivation layer formed on the gate insulation layer to cover the data line, source and drain electrodes, and data pad, wherein the passivation layer has a drain contact hole exposing a portion of the drain electrode, a gate pad contact hole exposing a portion of the gate pad, and a data pad contact hole exposing a portion of the data pad; and a pixel electrode, a gate pad terminal and a data pad terminal on the passivation layer, all of which are formed of a transparent conductive material on the passivation layer.
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