发明申请
- 专利标题: SUPERCRITICAL PROCESSING APPARATUS AND SUPERCRITICAL PROCESSING METHOD
- 专利标题(中): 超临界加工设备和超临界加工方法
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申请号: US13039361申请日: 2011-03-03
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公开(公告)号: US20110214694A1公开(公告)日: 2011-09-08
- 发明人: Takayuki TOSHIMA , Mitsuaki IWASHITA , Kazuyuki MITSUOKA , Hidekazu OKAMOTO , Hideo NAMATSU
- 申请人: Takayuki TOSHIMA , Mitsuaki IWASHITA , Kazuyuki MITSUOKA , Hidekazu OKAMOTO , Hideo NAMATSU
- 申请人地址: JP Tokyo
- 专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人: TOKYO ELECTRON LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP2010-049567 20100305
- 主分类号: B08B5/00
- IPC分类号: B08B5/00 ; B08B13/00
摘要:
Disclosed is a supercritical processing apparatus and a supercritical processing method for suppressing the pattern collapse or the injection of material constituting a processing liquid into a substrate. A processing chamber receives a substrate subjected to a processing with supercritical fluid, and a liquid supply unit supplies a processing liquid including a fluorine compound to the processing chamber. A liquid discharge unit discharges the supercritical fluid from the processing chamber, a pyrolysis ingredient removing unit removes an ingredient facilitating the pyrolysis of a liquid from the processing chamber or from the liquid supplied from the liquid supply unit, and a to heating unit heats the processing liquid including a fluorine compound of hydrofluoro ether or hydrofluoro carbon.