发明申请
- 专利标题: METHODS OF FABRICATING SEMICONDUCTOR DEVICES WITH SIDEWALL CONDUCTIVE PATTERNS
- 专利标题(中): 用导电模式制作半导体器件的方法
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申请号: US13110113申请日: 2011-05-18
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公开(公告)号: US20110217835A1公开(公告)日: 2011-09-08
- 发明人: Jong-Sun Sel , Jung-Dal Choi , Joon-Hee Lee , Hwa-Kyung Shin
- 申请人: Jong-Sun Sel , Jung-Dal Choi , Joon-Hee Lee , Hwa-Kyung Shin
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 优先权: KR10-2004-0089435 20041104
- 主分类号: H01L21/28
- IPC分类号: H01L21/28
摘要:
A gate pattern is disclosed that includes a semiconductor substrate, a lower conductive pattern, an upper conductive pattern, and a sidewall conductive pattern. The lower conductive pattern is on the substrate. The insulating pattern is on the lower conductive pattern. The upper conductive pattern is on the insulating pattern opposite to the lower conductive pattern. The sidewall conductive pattern is on at least a portion of sidewalls of the upper conductive pattern and the lower conductive pattern. The sidewall conductive pattern electrically connects the upper conductive pattern and the lower conductive pattern. An upper edge portion of the lower conductive pattern may be recessed relative to a lower edge portion of the lower conductive pattern to define a ledge thereon. The sidewall conductive pattern may be directly on the ledge and sidewall of the recessed upper edge portion of the lower conductive pattern.
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