A method for manufacturing a multilayer printed wiring board, the method includes forming a group of first through holes in a first insulating substrate; forming a group of second through holes in a second insulating substrate that has the same shape and the same size as a shape and a size, respectively, of the first insulating substrate, the second through holes having the same shape and the same size as a shape and a size, respectively, of the first through holes and being formed at the same positions as positions at which the first through holes are formed. At least one of the first through holes is filled with a first conductive member and at least one of the second through holes is filled with a second conductive member. And stacking the first insulating substrate and the second insulating substrate together.