Invention Application
- Patent Title: APPARATUS AND METHOD FOR TREATING SUBSTRATE
- Patent Title (中): 用于处理基板的装置和方法
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Application No.: US13039822Application Date: 2011-03-03
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Publication No.: US20110226626A1Publication Date: 2011-09-22
- Inventor: Ju-il Choi , Uihyoung Lee , Jae-hyun Phee , Jeong-Woo Park
- Applicant: Ju-il Choi , Uihyoung Lee , Jae-hyun Phee , Jeong-Woo Park
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR1020100025440 20100322
- Main IPC: C25D5/48
- IPC: C25D5/48 ; H01L21/306
Abstract:
A substrate treating device may include a plating treatment portion configured to perform a plating process of a substrate, a wet treatment portion configured to perform a wet treating process of the substrate, the wet treatment portion being under the plating treatment portion, and a substrate support portion configured to support the substrate so that a plating surface of the substrate faces upward, the substrate support portion being further configured to move the substrate between the plating treatment portion and the wet treatment portion.
Information query
