公开(公告)号：US20110226626A1

公开(公告)日：2011-09-22

申请号：US13039822

申请日：2011-03-03

Applicant: Ju-il Choi ,  Uihyoung Lee ,  Jae-hyun Phee ,  Jeong-Woo Park

Inventor： Ju-il Choi ,  Uihyoung Lee ,  Jae-hyun Phee ,  Jeong-Woo Park

IPC: C25D5/48 ,  H01L21/306

CPC classification number: H01L21/6723 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  H01L21/67028 ,  H01L21/6708 ,  H01L21/6719 ,  H01L21/68728 ,  H01L21/68785

Abstract: A substrate treating device may include a plating treatment portion configured to perform a plating process of a substrate, a wet treatment portion configured to perform a wet treating process of the substrate, the wet treatment portion being under the plating treatment portion, and a substrate support portion configured to support the substrate so that a plating surface of the substrate faces upward, the substrate support portion being further configured to move the substrate between the plating treatment portion and the wet treatment portion.

Abstract translation: 基板处理装置可以包括：电镀处理部，被配置为进行基板的电镀处理;湿处理部，被配置为进行基板的湿式处理;湿处理部位于电镀处理部下;以及基板支撑 被配置为支撑所述基板的部分，使得所述基板的电镀表面面向上，所述基板支撑部分还被配置为在所述电镀处理部分和所述湿处理部分之间移动所述基板。

公开(公告)号：US08129840B2

公开(公告)日：2012-03-06

申请号：US12503274

申请日：2009-07-15

Applicant: Chajea Jo ,  Uihyoung Lee ,  Jae-hyun Phee ,  Jeong-Woo Park ,  Ha-Young Yim

Inventor： Chajea Jo ,  Uihyoung Lee ,  Jae-hyun Phee ,  Jeong-Woo Park ,  Ha-Young Yim

IPC: H01L21/48

CPC classification number: H01L21/563 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/06051 ,  H01L2224/06102 ,  H01L2224/1146 ,  H01L2224/11472 ,  H01L2224/11505 ,  H01L2224/11902 ,  H01L2224/11912 ,  H01L2224/13027 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/14104 ,  H01L2224/1411 ,  H01L2224/14131 ,  H01L2224/17107 ,  H01L2224/73204 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package include a substrate including a plurality of pads and a plurality of bumps evenly disposed on an entire region of the substrate regardless of an arrangement of the plurality of pads. According to the present invention, a simplification of a process can be accomplished, a cost of a process can be reduced, reliability can be improved and an under-filling can become easy.

Abstract translation: 半导体封装以及半导体封装的制造方法。 半导体封装包括基板，其包括多个焊盘和均匀地设置在基板的整个区域上的多个凸块，而与多个焊盘的布置无关。 根据本发明，可以实现工艺的简化，可以降低工艺成本，可以提高可靠性，并且能够容易地进行填充不足。