发明申请
- 专利标题: FORMING APPARATUS AND FORMING METHOD OF WIRE JOINT PORTION
- 专利标题(中): 电线接头的形成装置和成形方法
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申请号: US13133417申请日: 2009-12-25
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公开(公告)号: US20110232083A1公开(公告)日: 2011-09-29
- 发明人: Kouji Daitou , Mikitsugu Suzuki , Kenji Tanaka , Noriyuki Fukaya , Tetsuro Ide
- 申请人: Kouji Daitou , Mikitsugu Suzuki , Kenji Tanaka , Noriyuki Fukaya , Tetsuro Ide
- 申请人地址: JP Tokyo
- 专利权人: YAZAKI CORPORATION
- 当前专利权人: YAZAKI CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2008-333064 20081226; JP2009-124257 20090522
- 国际申请: PCT/JP2009/071910 WO 20091225
- 主分类号: H01R43/00
- IPC分类号: H01R43/00 ; B23P19/04
摘要:
A forming apparatus for forming a wire joint portion including a connection portion and an insulative tube covering the connection portion is provided. The forming apparatus includes: a production information acquiring unit which acquires production information; a connection portion forming unit which fixes a plurality of wires selected on the basis of the production information, and then electrically connects conductor portions of the wires together to form the connection portion; a first fusing unit which fuses one open end portion of the insulative tube to close the one open end portion; an inserting unit which moves the wires so as to insert the connection portion into the insulative tube through the other open end portion of the insulative tube; a second fusing unit which fuses the other open end portion of the insulative tube and insulative sheaths of the wires together so as to form the wire joint portion.
公开/授权文献
- US08375573B2 Forming apparatus and forming method of wire joint portion 公开/授权日:2013-02-19
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