发明申请
- 专利标题： Carbon Laminated Enclosure
- 专利标题（中）： 碳层压外壳
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申请号： US13132119申请日： 2008-12-04
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公开(公告)号： US20110235255A1公开(公告)日： 2011-09-29
- 发明人: Chao-Wen Cheng , Mark H. Ruch , Mark S Tracy
- 申请人： Chao-Wen Cheng , Mark H. Ruch , Mark S Tracy
- 专利权人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 当前专利权人： HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- 国际申请： PCT/US08/85534 WO 20081204
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; G06F1/16 ; B32B1/02 ; B32B9/00 ; B82Y30/00
摘要：
An enclosure is provided. A housing (120) can have one or more walls (130). At least one of the one or more walls (130) can include a thermally conductive, carbonaceous member (100). The thermally conductive, carbonaceous member (100) can be partially or completely encapsulated within one or more electrically non-conductive materials.
公开/授权文献
- US08570747B2 Carbon laminated enclosure 公开/授权日：2013-10-29
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