发明申请
- 专利标题： HYBRID LIQUID METAL-SOLDER THERMAL INTERFACE
- 专利标题（中）： 混合液体金属焊接热界面
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申请号： US12750258申请日： 2010-03-30
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公开(公告)号： US20110240279A1公开(公告)日： 2011-10-06
- 发明人: BRUCE K. Furman , Paul A. Lauro , Yves C. Martin , Robert L. Sandstrom , Da-Yuan Shih , Theodore G. Van Kessel
- 申请人： BRUCE K. Furman , Paul A. Lauro , Yves C. Martin , Robert L. Sandstrom , Da-Yuan Shih , Theodore G. Van Kessel
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： F28F21/08
- IPC分类号： F28F21/08 ; B32B15/01 ; B23K35/02 ; B32B15/04
摘要：
The present invention is hybrid liquid metal-solder thermal interface. In one embodiment, a thermal interface for coupling a heat generating device to a heat sink includes a first metal interface layer, a second metal interface layer, and an isolation layer positioned between the first metal interface layer and the second metal interface layer, where at least one of the first metal interface layer and the second metal interface layer comprises a liquid metal.
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