发明申请
- 专利标题： WIRE BONDING STRUCTURE OF SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- 专利标题（中）： 半导体器件的线接合结构和接线方法
-
申请号： US13018993申请日： 2011-02-01
-
公开(公告)号： US20110241224A1公开(公告)日： 2011-10-06
- 发明人: Ryuji TSUBAKI , Yasufumi MATSUOKA
- 申请人： Ryuji TSUBAKI , Yasufumi MATSUOKA
- 申请人地址： JP Kyoto-shi
- 专利权人： ROHM CO., LTD.
- 当前专利权人： ROHM CO., LTD.
- 当前专利权人地址： JP Kyoto-shi
- 优先权： JP2010-080288 20100331
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/60 ; B23K37/04 ; B23K1/20 ; B23K3/08
摘要：
A wire bonding structure is provided which includes a wire having a first bonding portion and a second bonding portion. The first bonding portion is bonded to an electrode pad of a semiconductor element, whereas the second bonding portion is bonded to a pad portion of a lead. The first bonding portion includes a front bond portion, a rear bond portion, and an intermediate portion sandwiched between these two bond portions. The front bond portion and the rear bond portion are bonded to the electrode pad more strongly than the intermediate portion is. In the longitudinal direction of the wire, the second bonding portion is smaller than the first bonding portion in bonding length.
公开/授权文献
信息查询
IPC分类:
