公开(公告)号：US20110241224A1

公开(公告)日：2011-10-06

申请号：US13018993

申请日：2011-02-01

申请人： Ryuji TSUBAKI ,  Yasufumi MATSUOKA

发明人： Ryuji TSUBAKI ,  Yasufumi MATSUOKA

IPC分类号： H01L23/48 ,  H01L21/60 ,  B23K37/04 ,  B23K1/20 ,  B23K3/08

CPC分类号： H01L24/85 ,  B23K20/005 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/78314 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A wire bonding structure is provided which includes a wire having a first bonding portion and a second bonding portion. The first bonding portion is bonded to an electrode pad of a semiconductor element, whereas the second bonding portion is bonded to a pad portion of a lead. The first bonding portion includes a front bond portion, a rear bond portion, and an intermediate portion sandwiched between these two bond portions. The front bond portion and the rear bond portion are bonded to the electrode pad more strongly than the intermediate portion is. In the longitudinal direction of the wire, the second bonding portion is smaller than the first bonding portion in bonding length.

摘要翻译： 提供一种引线键合结构，其包括具有第一接合部分和第二接合部分的线。 第一接合部分接合到半导体元件的电极焊盘，而第二接合部分接合到引线的焊盘部分。 第一接合部分包括前接合部分，后接合部分和夹在这两个接合部分之间的中间部分。 前接合部分和后接合部分比中间部分更牢固地接合到电极焊盘。 在导线的长度方向上，第二接合部的接合长度小于第一接合部。