发明申请
US20110248005A1 Laser Cutting Method and Equipment, with means for Modifying the Laser Beam Quality Factor by a Diffractive Optical Component
审中-公开
激光切割方法和设备，具有通过衍射光学部件修改激光束质量因子的装置
- 专利标题： Laser Cutting Method and Equipment, with means for Modifying the Laser Beam Quality Factor by a Diffractive Optical Component
- 专利标题（中）： 激光切割方法和设备，具有通过衍射光学部件修改激光束质量因子的装置
-
申请号： US13063689申请日： 2009-08-26
-
公开(公告)号： US20110248005A1公开(公告)日： 2011-10-13
- 发明人: Francis Briand , Gaia Ballerini , Isabelle Debecker , Hakim Maazaoui , Erie Verna
- 申请人： Francis Briand , Gaia Ballerini , Isabelle Debecker , Hakim Maazaoui , Erie Verna
- 申请人地址： FR Paris
- 专利权人： L'Air Liquide Societe Anonyme Pour L'Etude Et L'Exploitation Des Procedes Georges Claude
- 当前专利权人： L'Air Liquide Societe Anonyme Pour L'Etude Et L'Exploitation Des Procedes Georges Claude
- 当前专利权人地址： FR Paris
- 优先权： FR0856140 20080912
- 国际申请： PCT/FR09/51629 WO 20090826
- 主分类号： B23K26/00
- IPC分类号： B23K26/00
摘要：
A method of cutting a work-piece to be cut by a laser beam, in which an incident laser beam is generated that has an initial beam parameter product (BPP), given by means of a laser source, preferably an ytterbium-doped or erbium-doped fiber laser source, coupled to at least one optical fiber for conveying the beam. Said incident laser beam is brought to a focusing head comprising at least one optical focusing device. The incident laser beam is focused by means of said optical focusing device, so as to obtain a focused laser beam, and the work-piece is cut by means of the focused laser beam. According to the invention, the quality factor of the incident laser beam is adjusted or modified by means of an optical device designed to be able to modify or vary the BPP of a laser beam so as to obtain a modified focused laser beam having a modified BPP which is different from the BPP of said incident laser beam. Associated equipment for implementing said method.
信息查询
