发明申请
- 专利标题： STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER WIRING BOARD INCLUDING THE INTERCONNECT ELEMENT
- 专利标题（中）： 制造互连元件的结构和方法，以及包括互连元件的多层布线板
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申请号： US13085126申请日： 2011-04-12
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公开(公告)号： US20110252637A1公开(公告)日： 2011-10-20
- 发明人: Kimitaka Endo , Norihito Masuda , Tomokazu Shimada
- 申请人： Kimitaka Endo , Norihito Masuda , Tomokazu Shimada
- 申请人地址： US CA San Jose
- 专利权人： TESSERA INTERCONNECT MATERIALS, INC.
- 当前专利权人： TESSERA INTERCONNECT MATERIALS, INC.
- 当前专利权人地址： US CA San Jose
- 优先权： JP2004-289722 20041001
- 主分类号： H05K3/00
- IPC分类号： H05K3/00
摘要：
A method of fabricating an interconnect element may include fabricating a metal layer that overlies a carrier layer and that includes a plurality of metal traces; providing a dielectric element to overlie the metal layer and the carrier layer; providing a plurality of metal posts; and removing the carrier layer to expose the first major surface of the dielectric element and the outer surfaces of the plurality of metal traces.
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