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    Process for forming a bump structure and bump structure
    2.
    发明申请
    Process for forming a bump structure and bump structure 失效
    用于形成凸块结构和凸块结构的工艺

    公开(公告)号：US20090121351A1

    公开(公告)日：2009-05-14

    申请号：US12290873

    申请日：2008-11-04

    申请人： Kimitaka Endo

    发明人： Kimitaka Endo

    IPC分类号： H01L23/48 ,  H01L21/44

    CPC分类号： H05K3/4007 ,  H01L21/4846 ,  H01L21/4853 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81192 ,  H01L2224/81399 ,  H01L2224/81444 ,  H01L2924/01019 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H05K3/20 ,  H05K2201/0367 ,  H05K2203/0113 ,  H01L2924/00014

    摘要： A method for forming a bump structure and a bump structure for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon, used as an electric connection in an electronic circuit, includes the steps of forming a mandrel by steps including forming at least one opening extending through a bump-forming die body in the thickness direction thereof and positioning a bump-forming die lid on a surface of the bump-forming die body so as to cover one end of the opening and to thereby define a bump-forming recess. The bump-forming die body may be comprised of a metal sheet. A metal layer is formed at least on an inner surface of the bump-forming die lid exposed within the bump-forming recess. The mandrel is removed so as to expose the metal layer and form a bump structure.

    摘要翻译： 用于形成凸起结构和用于与用于电子电路中的电连接的具有微电子器件或其上的布线的至少一个的另一元件的导电互连的凸块结构的方法包括以下步骤：通过以下步骤形成心轴： 至少一个开口沿其厚度方向延伸穿过凸块成形模体，并将凸块形成模具盖定位在凸块形成模具主体的表面上，以覆盖开口的一端， 形成凹槽。 凸块形成模体可以由金属板构成。 至少在凸块形成用模具盖的内表面上形成金属层，露出在凸块形成凹部内。 去除心轴以露出金属层并形成凸块结构。

    INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS
    3.
    发明申请
    INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS 审中-公开
    电路互连元件

    公开(公告)号：US20130119012A1

    公开(公告)日：2013-05-16

    申请号：US13661888

    申请日：2012-10-26

    申请人： TESSERA INTERCONNECT MATERIALS, INC.

    发明人： Kimitaka Endo

    IPC分类号： H01R43/02

    CPC分类号： H01R43/0256 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13609 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01322 ,  H05K1/185 ,  H05K3/06 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4614 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/10674 ,  H05K2203/0384 ,  H05K2203/0542 ,  H01L2224/05599

    摘要： An interconnection element and method for making same is disclosed. The interconnection element may include a plurality of metal conductors, a plurality of solid metal bumps and a low melting point (LMP) metal layer. The solid metal bumps overly and project in a first direction away from respective ones of the conductors. Each bump has at least one edge bounding the bump in at least a second direction transverse to the first direction. The low melting point (LMP) metal layer has a first face joined to the respective ones of the conductors and bounded in the second direction by at least one edge and a second face joined to the bumps. The edges of the bumps and the LMP layer are aligned in the first direction, and the LMP metal layer has a melting temperature substantially lower than the conductors.

    摘要翻译： 公开了互连元件及其制造方法。 互连元件可以包括多个金属导体，多个固体金属凸块和低熔点（LMP）金属层。 固体金属凸起并且远离相应导体的第一方向突出。 每个凸块具有至少一个沿至少一个横向于第一方向的第二方向限定凸块的边缘。 低熔点（LMP）金属层具有通过至少一个边缘和与凸块接合的第二面连接到各个导体并沿第二方向限定的第一面。 凸块和LMP层的边缘在第一方向上对齐，并且LMP金属层的熔化温度基本上低于导体。

    Structure and method of making interconnect element, and multilayer wiring board including the interconnect element
    4.
    发明授权
    Structure and method of making interconnect element, and multilayer wiring board including the interconnect element 有权
    制造互连元件的结构和方法，以及包括互连元件的多层布线板

    公开(公告)号：US07923828B2

    公开(公告)日：2011-04-12

    申请号：US11239744

    申请日：2005-09-30

    申请人： Kimitaka Endo ,  Norihito Masuda ,  Tomokazu Shimada

    发明人： Kimitaka Endo ,  Norihito Masuda ,  Tomokazu Shimada

    IPC分类号： H01R13/60

    CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/5383 ,  H01L2924/0002 ,  H05K3/064 ,  H05K3/205 ,  H05K3/423 ,  H05K3/4647 ,  H05K2203/0384 ,  H05K2203/0542 ,  H05K2203/0733 ,  Y10S438/931 ,  Y10T29/49124 ,  H01L2924/00

    摘要： An interconnect element is provided which includes a dielectric element having a first major surface, a second major surface remote from the first major surface, and a plurality of recesses extending inwardly from the first major surface. A plurality of metal traces are embedded in the plurality of recesses, the metal traces having outer surfaces substantially co-planar with the first major surface and inner surfaces remote from the outer surfaces. A plurality of posts extend from the inner surfaces of the plurality of metal traces through the dielectric element, the plurality of posts having tops exposed at the second major surface. A multilayer wiring board including a plurality of such interconnect elements is also provided, as well as various methods for making such interconnect elements and multilayer wiring boards.

    摘要翻译： 提供互连元件，其包括具有第一主表面的电介质元件，远离第一主表面的第二主表面和从第一主表面向内延伸的多个凹槽。 多个金属迹线嵌入在多个凹槽中，金属迹线具有与第一主表面和远离外表面的内表面基本上共面的外表面。 多个柱从多个金属迹线的内表面延伸通过介电元件，多个柱具有在第二主表面处露出的顶部。 还提供了包括多个这种互连元件的多层布线板，以及用于制造这种互连元件和多层布线板的各种方法。