发明申请
- 专利标题： ENCAPSULATION MATERIAL
- 专利标题（中）： 封装材料
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申请号： US12979158申请日： 2010-12-27
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公开(公告)号： US20110253942A1公开(公告)日： 2011-10-20
- 发明人: Min-Tsung Kuan , Ming-Chia Li , Wen-Hsien Wang , Kuo-Chan Chiou , Tzong-Ming Lee , Fang-Yao Yeh
- 申请人： Min-Tsung Kuan , Ming-Chia Li , Wen-Hsien Wang , Kuo-Chan Chiou , Tzong-Ming Lee , Fang-Yao Yeh
- 申请人地址： TW Hsinchu
- 专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- 当前专利权人地址： TW Hsinchu
- 优先权： TWTW99111556 20100414
- 主分类号： C09K11/06
- IPC分类号： C09K11/06
摘要：
Disclosed are encapsulation materials including an 80 to 99.5 weight percentage (wt %) of ethylene vinyl acetate copolymers (EVA) and a 0.5 to 20 weight percentage(wt %) of a photoluminescent polymer, wherein the EVA and the photoluminescent polymers are evenly blended. The encapsulation materials can be applied to packaging solar cells, and the encapsulating structure may protect the EVA from UV damage and enhance light utilization efficiency of the solar cell.
公开/授权文献
- US08465675B2 Encapsulation material 公开/授权日：2013-06-18
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