Invention Application
- Patent Title: Circuit board with buried circuit pattern
- Patent Title (中): 电路板埋设电路图案
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Application No.: US13067883Application Date: 2011-07-01
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Publication No.: US20110259627A1Publication Date: 2011-10-27
- Inventor: Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
- Applicant: Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2006-0105923 20061030
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11
Abstract:
A circuit board includes: an insulator having a groove; a circuit layer filling a portion of the groove; a solder pad on the circuit layer filling the remainder of the groove; and a circuit pattern electrically connected with the circuit layer, the circuit pattern buried in the insulator such that a portion of the circuit pattern is exposed at a surface of the insulator.
Information query
