发明申请
- 专利标题： Circuit board with buried circuit pattern
- 专利标题（中）： 电路板埋设电路图案
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申请号： US13067883申请日： 2011-07-01
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公开(公告)号： US20110259627A1公开(公告)日： 2011-10-27
- 发明人: Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
- 申请人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2006-0105923 20061030
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H05K1/11
摘要：
A circuit board includes: an insulator having a groove; a circuit layer filling a portion of the groove; a solder pad on the circuit layer filling the remainder of the groove; and a circuit pattern electrically connected with the circuit layer, the circuit pattern buried in the insulator such that a portion of the circuit pattern is exposed at a surface of the insulator.
信息查询
