发明申请
US20110260320A1 METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS
有权
制造与POSTS和PADS的连接部件的方法
- 专利标题： METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS
- 专利标题（中）： 制造与POSTS和PADS的连接部件的方法
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申请号： US13155825申请日： 2011-06-08
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公开(公告)号： US20110260320A1公开(公告)日： 2011-10-27
- 发明人: Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
- 申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
- 申请人地址： US CA San Jose
- 专利权人： TESSERA, INC.
- 当前专利权人： TESSERA, INC.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L23/498
- IPC分类号： H01L23/498
摘要：
A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
公开/授权文献
- US08604348B2 Method of making a connection component with posts and pads 公开/授权日：2013-12-10
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