发明申请
US20110269071A1 ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE COMPOSITION
审中-公开
化学敏感性或辐射敏感性树脂组合物，化学放大抗蚀剂组合物，耐腐蚀薄膜和使用组合物的形成方法
- 专利标题： ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND RESIST FILM AND PATTERN FORMING METHOD USING THE COMPOSITION
- 专利标题（中）： 化学敏感性或辐射敏感性树脂组合物，化学放大抗蚀剂组合物，耐腐蚀薄膜和使用组合物的形成方法
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申请号： US13095023申请日： 2011-04-27
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公开(公告)号： US20110269071A1公开(公告)日： 2011-11-03
- 发明人: Toru FUJIMORI , Shinki Yamada , Takamitsu Tomiga
- 申请人： Toru FUJIMORI , Shinki Yamada , Takamitsu Tomiga
- 申请人地址： JP Tokyo
- 专利权人： FUJIFILM Corporation
- 当前专利权人： FUJIFILM Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-104567 20100428; JP2010-138513 20100617; JP2010-138514 20100617
- 主分类号： G03F7/004
- IPC分类号： G03F7/004 ; G03F7/20
摘要：
An actinic ray-sensitive or radiation-sensitive resin composition of the first invention includes (A1) an acid-decomposable resin, the resin containing three kinds of repeating units each having a specific structure, (B) a photo-acid generator and (C1) a 2-phenylbenzimidazole-based basic compound; an actinic ray-sensitive or radiation-sensitive resin composition of the second invention includes (A2) an acid-decomposable resin, (B) a photo-acid generator and (C2) 2-heteryl benzimidazole-based basic compound; a chemical amplification resist composition of the third invention includes (A3) an acid-decomposable resin, (B) a photo-acid generator and (C3) a benzimidazole-based basic compound having a sulfur atom-containing specific structure; and a resist film and a pattern forming method each use such a composition.
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