Invention Application
US20110271750A1 Method and device for measuring the thickness of thin layers over large-area surfaces to be measured
有权
用于测量要测量的大面积表面上的薄层厚度的方法和装置
- Patent Title: Method and device for measuring the thickness of thin layers over large-area surfaces to be measured
- Patent Title (中): 用于测量要测量的大面积表面上的薄层厚度的方法和装置
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Application No.: US13068407Application Date: 2011-05-10
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Publication No.: US20110271750A1Publication Date: 2011-11-10
- Inventor: Helmut Fischer
- Applicant: Helmut Fischer
- Priority: DE102010020116.2 20100510
- Main IPC: G01B21/08
- IPC: G01B21/08

Abstract:
The invention relates to a method and a device for measuring the thickness of thin layers over large-area surfaces to be measured (12), in which at least one measuring probe (28), which comprises at least one sensor element (29) and at least one contact spherical cap (31) associated with the sensor element (29), is applied to the surface to be measured (12) in order to obtain a measured value, wherein the large-area surface to be measured (12) is subdivided into individual partial areas (14), a matrix of measurement points (16) is determined for each partial area (14) to be inspected, measured values are ascertained at equidistant measurement points (16) along at least one row (17) of the matrix of the partial area (14) using a device (21) carrying the at least one measuring probe (28), and the measured values are ascertained successively for all rows (17) in the matrix in the partial area (14) and evaluated for this partial area (14).
Public/Granted literature
- US08474151B2 Method and device for measuring the thickness of thin layers over large-area surfaces to be measured Public/Granted day:2013-07-02
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