发明申请
- 专利标题: METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD
- 专利标题(中): 生产多层印刷电路板的方法,粘合防止材料和多层印刷电路板以及这种方法的使用
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申请号: US13145651申请日: 2010-01-22
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公开(公告)号: US20110272177A1公开(公告)日: 2011-11-10
- 发明人: Günther Weichslberger , Johannes Stahr , Markus Leitgeb , Andreas Zluc , Gerald Weidinger
- 申请人: Günther Weichslberger , Johannes Stahr , Markus Leitgeb , Andreas Zluc , Gerald Weidinger
- 优先权: ATGM47/2009 20090127
- 国际申请: PCT/AT2010/000024 WO 20100122
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; C08L91/00 ; H05K3/00
摘要:
In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided.