公开(公告)号：US08541690B2

公开(公告)日：2013-09-24

申请号：US12227364

申请日：2007-05-15

申请人： Hannes Voraberger ,  Gerhard Schmid ,  Markus Riester ,  Johannes Stahr

发明人： Hannes Voraberger ,  Gerhard Schmid ,  Markus Riester ,  Johannes Stahr

IPC分类号： H05K1/16 ,  H05K1/18

CPC分类号： H01L23/498 ,  H01L21/4846 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/113 ,  H05K1/186 ,  H05K3/005 ,  H05K3/107 ,  H05K3/4644 ,  H05K3/465 ,  H05K3/4652 ,  H05K2201/09436 ,  H05K2201/10734 ,  Y10T29/4913 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method for fixing an electronic component on a printed circuit board, and contact-connecting the electronic component to the printed circuit board, the following steps are provided:—providing the printed circuit board having a plurality of contact and connection pads,—providing the electronic component having a number of contact and connection locations corresponding to the plurality of contact and connection pads, with a mutual spacing reduced in comparison with the spacing of the contact and connection pads, and—arranging or forming at least one interlayer for routing the contact and connection locations of the electronic component between the contact and connection pads and the contact and connection locations of the electronic component. A method for producing an interlayer for routing and a system having a printed circuit board and an electronic component using the interlayer for routing are also provided.

摘要翻译： 一种用于将电子部件固定在印刷电路板上并将电子部件接触连接到印刷电路板的方法，提供以下步骤： - 提供具有多个接触和连接焊盘的印刷电路板， - 提供 电子部件具有对应于多个接触和连接焊盘的多个接触和连接位置，与接触和连接焊盘的间隔相比，相互间隔减小，并且布置或形成至少一个中间层用于布线接触 以及电子部件在触点和连接焊盘之间的连接位置以及电子部件的接触和连接位置。 还提供了一种制造用于布线的中间层的方法和具有使用该层间路由的印刷电路板和电子部件的系统。

公开(公告)号：US08541689B2

公开(公告)日：2013-09-24

申请号：US12449611

申请日：2008-01-30

申请人： Gerald Weidinger ,  Markus Leitgeb ,  Johannes Stahr ,  Günther Weichslberger ,  Andreas Zluc

发明人： Gerald Weidinger ,  Markus Leitgeb ,  Johannes Stahr ,  Günther Weichslberger ,  Andreas Zluc

IPC分类号： H05K1/00 ,  H05K3/02

CPC分类号： H05K1/00 ,  H05K1/183 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  Y10T29/49155

摘要： The invention relates to a method for removing a part of a substantially planar material layer (2) which is connected to at least one further, substantially planar material layer (9) in a connecting step. According to the invention, a zone where the material layers (2, 9) are not directly interconnected is provided in the zone where the part (11) is later on removed, said first zone being provided by applying a material (8) that prevents the material layers to be interconnected from sticking to each other. The invention also relates to a multilayer structure and to the use of the method and to a multilayer structure especially for producing a multilayer printed circuit board.

摘要翻译： 本发明涉及一种用于去除在连接步骤中连接到至少一个其它基本平坦的材料层（9）的基本平坦的材料层（2）的一部分的方法。 根据本发明，在部分（11）稍后被移除的区域中提供材料层（2,9）不直接互连的区域，所述第一区域通过施加材料（8）来提供，所述材料防止 待彼此相互连接的材料层。 本发明还涉及一种多层结构，以及该方法和多层结构的使用，特别是用于制造多层印刷电路板。

公开(公告)号：US20110272177A1

公开(公告)日：2011-11-10

申请号：US13145651

申请日：2010-01-22

申请人： Günther Weichslberger ,  Johannes Stahr ,  Markus Leitgeb ,  Andreas Zluc ,  Gerald Weidinger

发明人： Günther Weichslberger ,  Johannes Stahr ,  Markus Leitgeb ,  Andreas Zluc ,  Gerald Weidinger

IPC分类号： H05K1/02 ,  C08L91/00 ,  H05K3/00

CPC分类号： H05K3/4688 ,  H05K1/0298 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4691 ,  H05K3/4697 ,  H05K2201/09127 ,  Y10T29/49124 ,  Y10T156/1066 ,  Y10T156/1195

摘要： In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided.

摘要翻译： 在多层印刷电路板的制造方法中，多层印刷电路板由多个导电或不导电或不导电或绝缘层或层组成，以彼此连接，特别是被压在一起，其中至少部分平面的层至少连接 去除其部分区域（11），并且其中为了防止待除去的部分区域（11）的粘附，根据待除去的部分区域（9）施加防止粘附的材料（8）（9） ），其邻接待移除的部分区域，条件是防止粘附的材料（8）由包含基于至少一种金属皂的脱模剂的混合物形成，优选由Al，Mg的脂肪酸盐， Ca，Na和Zn，粘合剂和溶剂，由此在多层印刷电路板的适当处理和/或加工步骤之后，可以容易且可靠地除去待除去的部分区域。 另外，提供了一种防粘连材料和与制造多层印刷电路板（1）相关的方法的使用。

公开(公告)号：US20110067908A1

公开(公告)日：2011-03-24

申请号：US12736916

申请日：2009-05-20

申请人： Günther Weichslberger ,  Johannes Stahr

发明人： Günther Weichslberger ,  Johannes Stahr

IPC分类号： H05K1/09 ,  H05K3/30

CPC分类号： H05K3/328 ,  A47F3/001 ,  A47F11/10 ,  B23K35/0238 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/3053 ,  B23K2101/36 ,  H05K3/244 ,  H05K3/3463 ,  H05K3/363 ,  H05K2203/0278 ,  Y10T29/4913

摘要： The invention relates to a method for fixing a component (6) to or in a printed circuit board (1) and/or for connecting individual elements of a printed circuit board, wherein regions of a component (6) and/or of a printed circuit board (1) to be interconnected or to be fixed to one another are provided with at least one respective solder layer (4, 5, 9, 10), the solder layers (4, 5, 9, 10) are contacted with each other and are interconnected at a pressure and a temperature that is elevated above ambient conditions, an intermetallic diffusion layer (12) being formed, thereby achieving a high-strength connection. The invention further relates to the use of said method and to a printed circuit board (1).

摘要翻译： 本发明涉及一种用于将部件（6）固定到印刷电路板（1）中或印刷电路板（1）中和/或用于连接印刷电路板的各个元件的方法，其中部件（6）和/或印刷电路板 电路板（1）互连或彼此固定设置有至少一个相应的焊料层（4,5,9,10），焊料层（4,5,9,10）与每个焊料层 另一个并且在高于环境条件的压力和温度下互连，形成金属间扩散层（12），从而实现高强度连接。 本发明还涉及所述方法和印刷电路板（1）的使用。

公开(公告)号：US20120275124A1

公开(公告)日：2012-11-01

申请号：US13383237

申请日：2010-07-09

申请人： Rainer Pludra ,  Dietmar Drofenik ,  Johannes Stahr ,  Siegfried Götzinger ,  Liubomir Mareljic

发明人： Rainer Pludra ,  Dietmar Drofenik ,  Johannes Stahr ,  Siegfried Götzinger ,  Liubomir Mareljic

IPC分类号： H05K3/10 ,  H05K7/06

CPC分类号： H05K1/142 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K3/225 ,  H05K3/368 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09163 ,  H05K2201/09845 ,  H05K2203/1461 ,  Y10T29/49155

摘要： In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions (20, 21, 22) to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions (20, 21, 22) to be connected to one another, at least one additional layer or ply of the printed circuit board is arranged or applied over the printed circuit board regions (20, 21, 22) to be connected to one another, it is provided that the additional layer is embodied as a conductive layer (26), which is contact-connected via plated-through holes (23) to conductive layers or devices or components integrated in the printed circuit board regions (20, 21, 22) to be connected to one another, as a result of which a simple and reliable connection or coupling of printed circuit board regions (20, 21, 22) to be connected to one another can be made available.Furthermore, a printed circuit board consisting of a plurality of printed circuit board regions (20, 21, 22) is made available.

摘要翻译： 在制造由至少两个印刷电路区域组成的印刷电路板的方法中，其中印刷电路板区域各自包括至少一个导电层和/或至少一个器件或一个导电部件，其中印刷电路板区域（20 ，21,22）彼此连接，在每种情况下，至少一个彼此直接相邻的侧表面的区域通过联接或连接彼此连接，并且其中在连接或连接印刷后 电路板区域（20,21,22）彼此连接，印刷电路板的至少一个附加层或层被布置或施加在印刷电路板区域（20,21,22）上以被连接到 另一方面，附加层被实施为导电层（26），其通过电镀通孔（23）与导电层或集成在印刷电路板区域中的器件或部件接触连接 ns（20,21,22）彼此连接，结果可以使得要彼此连接的印刷电路板区域（20,21,22）的简单且可靠的连接或耦合可用。 此外，由多个印刷电路板区域（20,21,22）组成的印刷电路板是可用的。

公开(公告)号：US20220377917A1

公开(公告)日：2022-11-24

申请号：US17663717

申请日：2022-05-17

申请人： Johannes STAHR ,  Gerald WEIDINGER ,  Ahmad Bader ALOTHMAN ALTERKAWI

发明人： Johannes STAHR ,  Gerald WEIDINGER ,  Ahmad Bader ALOTHMAN ALTERKAWI

IPC分类号： H05K5/00

摘要： A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a magnetic element assembled to the stack. The magnetic element includes a magnetic matrix and an inductive element. The inductive element is at least partially enclosed by the magnetic matrix, so that an electric current flow direction through the inductive element is essentially in a horizontal direction with respect to the stack. Further, a magnetic inlay and a manufacturing method are described.

公开(公告)号：US08705905B2

公开(公告)日：2014-04-22

申请号：US12675884

申请日：2008-09-11

申请人： Gregor Langer ,  Johannes Stahr

发明人： Gregor Langer ,  Johannes Stahr

IPC分类号： G02B6/12

CPC分类号： G02B6/43 ,  G02B6/138 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  H05K2201/09127

摘要： The invention relates to a printed circuit board element (10), comprising at least one flexible printed circuit board part (12) and at least one rigid printed circuit board part (11A, 11C; 34, 35; 37) having a component (17), which is accommodated in a cavity (14) and with a light-emitting or light-receiving part (17) projects over the edge (18) of the cavity (14), wherein the flexible printed circuit board part (12) has a flexible layer (15′) made of an optical, photo-polymerizable material (15), in which an optical fiber (15) is structured in alignment with the light-emitting or light-receiving part (17) of the optoelectronic component (17) by way of radiation.

摘要翻译： 本发明涉及一种印刷电路板元件（10），其包括至少一个柔性印刷电路板部分（12）和至少一个刚性印刷电路板部分（11A，11C; 34,35,37），其具有部件（17 ），其容纳在空腔（14）中并且发光或光接收部分（17）突出在空腔（14）的边缘（18）上方，其中柔性印刷电路板部件（12）具有 由光学可光聚合材料（15）制成的柔性层（15'），其中光纤（15）被构造成与光电子部件的发光或光接收部分（17）对准 17）通过辐射。

公开(公告)号：US08685196B2

公开(公告)日：2014-04-01

申请号：US13145651

申请日：2010-01-22

申请人： Günther Weichslberger ,  Johannes Stahr ,  Markus Leitgeb ,  Andreas Zluc ,  Gerald Weidinger

发明人： Günther Weichslberger ,  Johannes Stahr ,  Markus Leitgeb ,  Andreas Zluc ,  Gerald Weidinger

IPC分类号： B29C65/18 ,  B32B37/26 ,  B32B38/10 ,  B32B38/14

CPC分类号： H05K3/4688 ,  H05K1/0298 ,  H05K3/4602 ,  H05K3/4652 ,  H05K3/4691 ,  H05K3/4697 ,  H05K2201/09127 ,  Y10T29/49124 ,  Y10T156/1066 ,  Y10T156/1195

摘要： In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region (11) thereof is removed, and wherein in order to prevent adherence of the partial region (11) to be removed a material (8) preventing adhesion is applied in accordance with the partial region to be removed onto a layer (9) which adjoins the partial region to be removed, it is provided that the material (8) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board (1) are provided.

摘要翻译： 在多层印刷电路板的制造方法中，多层印刷电路板由多个导电或不导电或不导电或绝缘层或层组成，以彼此连接，特别是被压在一起，其中至少部分平面的层至少连接 去除其部分区域（11），并且其中为了防止待除去的部分区域（11）的粘附，根据待除去的部分区域（9）施加防止粘附的材料（8）（9） ），其邻接待移除的部分区域，条件是防止粘附的材料（8）由包含基于至少一种金属皂的脱模剂的混合物形成，优选由Al，Mg的脂肪酸盐， Ca，Na和Zn，粘合剂和溶剂，由此在多层印刷电路板的适当处理和/或加工步骤之后，可以容易且可靠地除去待除去的部分区域。 另外，提供了一种防粘连材料和与制造多层印刷电路板（1）相关的方法的使用。

公开(公告)号：US20140000941A1

公开(公告)日：2014-01-02

申请号：US13980383

申请日：2012-01-24

申请人： Gerald Weidinger ,  Andreas Zluc ,  Johannes Stahr

发明人： Gerald Weidinger ,  Andreas Zluc ,  Johannes Stahr

IPC分类号： H05K1/02 ,  H05K3/30 ,  H05K1/09

CPC分类号： H05K1/188 ,  F16D13/72 ,  F16D69/026 ,  F16D2069/004 ,  F16D2200/0073 ,  F16D2250/0046 ,  F16D2300/10 ,  H01L21/568 ,  H01L24/18 ,  H01L24/82 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K1/0212 ,  H05K1/0271 ,  H05K1/09 ,  H05K1/182 ,  H05K1/185 ,  H05K1/186 ,  H05K1/187 ,  H05K3/30 ,  H05K2203/0152 ,  H05K2203/1469 ,  Y10T29/49146 ,  H01L2924/00

摘要： In a method for integrating at least one electronic component into a printed circuit board or a printed circuit board intermediate product, the following steps are provided: providing a layer for at least temporarily supporting the electronic component, fixing the electronic component on the layer, arranging a conductive layer on the supporting layer with at least one cutout corresponding to the dimensions of the electronic component to be fixed, at least partly encapsulating or covering the component fixed on the supporting layer with an insulating material, exposing the electronic component, and at least partial regions of the conductive layer, which adjoins the component and is arranged on the supporting layer, and at least partly making contact between the electronic component and the conductive layer adjoining the component. Furthermore, a printed circuit board and a printed circuit board intermediate product having an integrated electronic component are provided.

摘要翻译： 在将至少一个电子部件集成到印刷电路板或印刷电路板中间产品中的方法中，提供以下步骤：提供用于至少临时支撑电子部件的层，将电子部件固定在层上，布置 支撑层上的导电层，具有至少一个对应于要固定的电子部件的尺寸的切口，至少部分地用绝缘材料封装或覆盖固定在支撑层上的部件，暴露电子部件，并且至少 导电层的部分区域，其邻接部件并且布置在支撑层上，并且至少部分地使电子部件与与部件相邻的导电层之间接触。 此外，提供了具有集成电子部件的印刷电路板和印刷电路板中间产品。

公开(公告)号：US20110051384A1

公开(公告)日：2011-03-03

申请号：US12162016

申请日：2007-02-02

申请人： Arno Kriechbaum ,  Wolfgang Bauer ,  Johannes Stahr ,  Sabine Liebfahrt

发明人： Arno Kriechbaum ,  Wolfgang Bauer ,  Johannes Stahr ,  Sabine Liebfahrt

IPC分类号： H05K1/18 ,  B32B37/02

CPC分类号： H01L23/5389 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/274 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0665 ,  H01L2924/12033 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2203/0191 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

摘要： A printed circuit board element (1) comprising at least one component (2) embedded between a base (4) and a cover layer (6), which component (2) is adhered to the base (4) by means of an adhesive film section (3).

摘要翻译： 一种印刷电路板元件（1），其包括嵌入在基底（4）和覆盖层（6）之间的至少一个部件（2），所述部件（2）通过粘合膜粘附到基部（4） 第（3）节。