发明申请
- 专利标题： Lead Frame and Method of Producing Lead Frame
- 专利标题（中）： 引线框架及其制作方法
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申请号： US12674100申请日： 2008-09-12
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公开(公告)号： US20110272768A1公开(公告)日： 2011-11-10
- 发明人: Toshimi Nakamura , Toshiaki Kawanishi , Toshihiro Hosoi , Kenjiro Izutani , Hiroyuki Nakamura , Yutaka Osawa , Hiroaki Sunada , Tetsuyasu Takahashi
- 申请人： Toshimi Nakamura , Toshiaki Kawanishi , Toshihiro Hosoi , Kenjiro Izutani , Hiroyuki Nakamura , Yutaka Osawa , Hiroaki Sunada , Tetsuyasu Takahashi
- 申请人地址： JP Miyoshi-shi JP Tokyo
- 专利权人： SUN-A CORPORATION,MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人： SUN-A CORPORATION,MITSUI MINING & SMELTING CO., LTD.
- 当前专利权人地址： JP Miyoshi-shi JP Tokyo
- 优先权： JP2007-238567 20070913; JP2007-238568 20070913
- 国际申请： PCT/JP2008/066606 WO 20080912
- 主分类号： H01L23/522
- IPC分类号： H01L23/522 ; H01L21/56 ; H01L21/60 ; H01L29/66
摘要：
Provided is a lead frame, an electronic device provided with a lead frame, a method of producing a lead frame, and a method of producing an electronic device provided with a lead frame that has been produced by the method of producing a lead frame, in which a lead frame is not corroded, a mechanical strength of the lead frame is not lowered, it is not necessary to carry out the conventional plating processing steps composed of two stages, the processes are simple, a cost is lower, and a large amount of waste liquid such as plating processing liquid is not generated, thereby preventing an environment from being affected. The lead frame includes an outer lead part and an inner lead part, and plating is carried out on at least a part of one or both of the outer lead part or the inner lead part.
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