公开(公告)号：US20110272768A1

公开(公告)日：2011-11-10

申请号：US12674100

申请日：2008-09-12

申请人： Toshimi Nakamura ,  Toshiaki Kawanishi ,  Toshihiro Hosoi ,  Kenjiro Izutani ,  Hiroyuki Nakamura ,  Yutaka Osawa ,  Hiroaki Sunada ,  Tetsuyasu Takahashi

发明人： Toshimi Nakamura ,  Toshiaki Kawanishi ,  Toshihiro Hosoi ,  Kenjiro Izutani ,  Hiroyuki Nakamura ,  Yutaka Osawa ,  Hiroaki Sunada ,  Tetsuyasu Takahashi

IPC分类号： H01L23/522 ,  H01L21/56 ,  H01L21/60 ,  H01L29/66

CPC分类号： H01L23/49582 ,  G01L19/0084 ,  G01L19/141 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： Provided is a lead frame, an electronic device provided with a lead frame, a method of producing a lead frame, and a method of producing an electronic device provided with a lead frame that has been produced by the method of producing a lead frame, in which a lead frame is not corroded, a mechanical strength of the lead frame is not lowered, it is not necessary to carry out the conventional plating processing steps composed of two stages, the processes are simple, a cost is lower, and a large amount of waste liquid such as plating processing liquid is not generated, thereby preventing an environment from being affected. The lead frame includes an outer lead part and an inner lead part, and plating is carried out on at least a part of one or both of the outer lead part or the inner lead part.

摘要翻译： 本发明提供一种引线框架，具备引线框架的电子设备，引线框架的制造方法以及具有引线框架的电子设备的制造方法，所述引线框架是通过制造引线框架的方法制造的， 引线框架不被腐蚀，引线框架的机械强度不降低，不需要执行由两个阶段组成的常规电镀处理步骤，该工艺简单，成本较低并且大量 的废液如电镀处理液不会产生，从而防止环境受到影响。 引线框架包括外引线部分和内引线部分，并且在外引线部分或内引线部分中的一个或两个的至少一部分上进行电镀。