发明申请
US20110272822A1 Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors
审中-公开
具有导电通孔的半导体元件与对准的背面导体
- 专利标题： Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors
- 专利标题（中）： 具有导电通孔的半导体元件与对准的背面导体
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申请号： US13187730申请日： 2011-07-21
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公开(公告)号： US20110272822A1公开(公告)日： 2011-11-10
- 发明人: Jin Li , Tongbi Jiang
- 申请人： Jin Li , Tongbi Jiang
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.
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