公开(公告)号：US06995442B2

公开(公告)日：2006-02-07

申请号：US10757589

申请日：2004-01-15

Applicant: Tongbi Jiang ,  Michael Connell ,  Jin Li

Inventor： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC: H01L31/0232 ,  H01L21/00

CPC classification number: H01L27/14625 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L27/14685

Abstract: The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

公开(公告)号：US20110272822A1

公开(公告)日：2011-11-10

申请号：US13187730

申请日：2011-07-21

Applicant: Jin Li ,  Tongbi Jiang

Inventor： Jin Li ,  Tongbi Jiang

IPC: H01L23/48

CPC classification number: H01L21/76898 ,  H01L21/6836 ,  H01L24/16 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05025 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/27416 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/013

Abstract: A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.

Abstract translation: 半导体部件包括半导体衬底，具有端子部分的衬底中的导电通孔，衬底上的聚合物层和由嵌入聚合物层中的导电通孔的端子部分形成的背面导体。 堆叠的半导体部件包括具有彼此电连通的对准的导电通孔的多个部件。

公开(公告)号：US07998860B2

公开(公告)日：2011-08-16

申请号：US12402649

申请日：2009-03-12

Applicant: Jin Li ,  Tongbi Jiang

Inventor： Jin Li ,  Tongbi Jiang

IPC: H01L21/44

CPC classification number: H01L21/76898 ,  H01L21/6836 ,  H01L24/16 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05025 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/27416 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/013

Abstract: A method for fabricating semiconductor components includes the steps of: providing a semiconductor substrate having a circuit side, a back side and conductive vias; removing portions of the substrate from the back side to expose terminal portions of the conductive vias; depositing a polymer layer on the back side encapsulating the terminal portions; and then planarizing the polymer layer and ends of the terminal portions to form self aligned conductors embedded in the polymer layer. Additional back side elements, such as terminal contacts and back side redistribution conductors, can also be formed in electrical contact with the conductive vias. A semiconductor component includes the semiconductor substrate, the conductive vias, and the back side conductors embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.

Abstract translation: 一种制造半导体器件的方法包括以下步骤：提供具有电路侧，背面和导电通孔的半导体衬底; 从背面去除衬底的部分以暴露导电通孔的端子部分; 在封装端子部分的背侧沉积聚合物层; 然后平面化聚合物层和末端部分的端部以形成嵌入聚合物层中的自对准导体。 附加的背面元件，例如端子触点和背面再分布导体也可以形成为与导电通孔电接触。 半导体部件包括半导体衬底，导电通路和嵌入聚合物层中的背面导体。 堆叠的半导体部件包括具有彼此电连通的对准的导电通孔的多个部件。

公开(公告)号：US07001795B2

公开(公告)日：2006-02-21

申请号：US10373785

申请日：2003-02-27

Applicant: Tongbi Jiang ,  Michael Connell ,  Jin Li

Inventor： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC: H01L21/00 ,  H01L31/0232

CPC classification number: H01L27/14625 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L27/14685

Abstract: The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

Abstract translation: 本发明涉及使用光电导体作为CMOS芯片中的光导体的光导体，其中所述光导体由至少一种低折射率材料（即空气）分开。 本发明提供了优于先前CMOS成像技术的优点，包括对光电二极管的增强的光传输。 用于制造CMOS成像装置和CMOS成像器系统的即时方法涉及最小的功率损耗。 由于不需要镜头，本发明消除了对于半径限制以及关于在芯片附着，后研磨和安装期间损坏的透镜的担忧。 本发明还提供了很少或没有光二极管之间的串扰。

公开(公告)号：US20100230794A1

公开(公告)日：2010-09-16

申请号：US12402649

申请日：2009-03-12

Applicant: Jin Li ,  Tongbi Jiang

Inventor： Jin Li ,  Tongbi Jiang

IPC: H01L23/52 ,  H01L21/768 ,  H01L21/50 ,  H01L23/498

CPC classification number: H01L21/76898 ,  H01L21/6836 ,  H01L24/16 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05025 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/27416 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/013

Abstract: A method for fabricating semiconductor components includes the steps of: providing a semiconductor substrate having a circuit side, a back side and conductive vias; removing portions of the substrate from the back side to expose terminal portions of the conductive vias; depositing a polymer layer on the back side encapsulating the terminal portions; and then planarizing the polymer layer and ends of the terminal portions to form self aligned conductors embedded in the polymer layer. Additional back side elements, such as terminal contacts and back side redistribution conductors, can also be formed in electrical contact with the conductive vias. A semiconductor component includes the semiconductor substrate, the conductive vias, and the back side conductors embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another.

Abstract translation: 一种制造半导体器件的方法包括以下步骤：提供具有电路侧，背面和导电通孔的半导体衬底; 从背面去除衬底的部分以暴露导电通孔的端子部分; 在封装端子部分的背侧沉积聚合物层; 然后平面化聚合物层和末端部分的端部以形成嵌入聚合物层中的自对准导体。 附加的背面元件，例如端子触点和背面再分布导体也可以形成为与导电通孔电接触。 半导体部件包括半导体衬底，导电通路和嵌入聚合物层中的背面导体。 堆叠的半导体部件包括具有彼此电连通的对准的导电通孔的多个部件。

公开(公告)号：US07557337B2

公开(公告)日：2009-07-07

申请号：US11257041

申请日：2005-10-25

Applicant: Tongbi Jiang ,  Michael Connell ,  Jin Li

Inventor： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC: H01J3/14

CPC classification number: H01L27/14627 ,  B33Y80/00

Abstract: An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

Abstract translation: 一种改进的图像传感器，其中由一个或多个微透镜组成的第一微透镜阵列位于空腔上方，使得入射光聚焦在图像传感器的光传感器上。 第一微透镜阵列可以将入射光准直并聚焦到图像传感器的光传感器上，或者可以校准入射光并将其引导到第二微透镜阵列，然后将第二微透镜阵列聚焦到光传感器上。 还提供了一种制造改进的图像传感器的方法，其中腔和第一微透镜阵列通过使用牺牲材料形成。

公开(公告)号：US20060038112A1

公开(公告)日：2006-02-23

申请号：US11257039

申请日：2005-10-25

Applicant: Tongbi Jiang ,  Michael Connell ,  Jin Li

Inventor： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC: H01L27/00

CPC classification number: H01L27/14627 ,  B33Y80/00

Abstract: An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

公开(公告)号：US20110235306A1

公开(公告)日：2011-09-29

申请号：US12732046

申请日：2010-03-25

Applicant: Jin Li ,  Tongbi Jiang

Inventor： Jin Li ,  Tongbi Jiang

IPC: F21V9/16 ,  F21V1/00 ,  H01R43/00

CPC classification number: H01L33/58 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/50 ,  H01L33/505 ,  H01L2924/0002 ,  Y10T29/49117 ,  H01L2924/00

Abstract: Solid state lighting (SSL) devices including a plurality of SSL emitters and methods for manufacturing SSL devices are disclosed. Several embodiments of SSL devices in accordance with the technology include a support having a first lead and a second lead, a plurality of individual SSL emitters attached to the support, and a plurality of lenses. Each SSL emitter has a first contact electrically coupled to the first lead of the support and a second contact electrically coupled to the second lead of the support such that the SSL emitters are commonly connected. Each lens has a curved surface and is aligned with a single corresponding SSL emitter.

Abstract translation: 公开了包括多个SSL发射器的固态照明（SSL）设备和用于制造SSL设备的方法。 根据该技术的SSL设备的几个实施例包括具有第一引线和第二引线，附接到支撑件的多个单独的SSL发射器和多个透镜的支撑件。 每个SSL发射器具有电耦合到支撑件的第一引线的第一触点和电耦合到支撑件的第二引线的第二触点，使得SSL发射器被共同连接。 每个镜头都有一个曲面，并与一个对应的SSL发射器对齐。

公开(公告)号：US20060033010A1

公开(公告)日：2006-02-16

申请号：US11257041

申请日：2005-10-25

Applicant: Tongbi Jiang ,  Michael Connell ,  Jin Li

Inventor： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC: H01L27/00

CPC classification number: H01L27/14627 ,  B33Y80/00

Abstract: An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

公开(公告)号：US20050274993A1

公开(公告)日：2005-12-15

申请号：US10373785

申请日：2003-02-27

Applicant: Tongbi Jiang ,  Michael Connell ,  Jin Li

Inventor： Tongbi Jiang ,  Michael Connell ,  Jin Li

IPC: H01L27/146 ,  H01L31/062 ,  H01L31/113

CPC classification number: H01L27/14625 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14643 ,  H01L27/14685

Abstract: The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

Abstract translation: 本发明涉及使用光电导体作为CMOS芯片中的光导体的光导体，其中所述光导体由至少一种低折射率材料（即空气）分开。 本发明提供了优于先前CMOS成像技术的优点，包括对光电二极管的增强的光传输。 用于制造CMOS成像装置和CMOS成像器系统的即时方法涉及最小的功率损耗。 由于不需要镜头，本发明消除了对于半径限制以及关于在芯片附着，后研磨和安装期间损坏的透镜的担忧。 本发明还提供了很少或没有光二极管之间的串扰。