发明申请
- 专利标题： SEMICONDUCTOR PACKAGE HAVING INK-JET TYPE DAM AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 具有喷墨型DAM的半导体封装及其制造方法
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申请号： US13182588申请日： 2011-07-14
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公开(公告)号： US20110275177A1公开(公告)日： 2011-11-10
- 发明人: Choong-bin Yim , Tae-je Cho
- 申请人： Choong-bin Yim , Tae-je Cho
- 优先权： KR10-2008-0095519 20080929
- 主分类号： H01L21/58
- IPC分类号： H01L21/58
摘要：
A semiconductor package includes a substrate which includes a chip mounting unit disposed on a first surface thereof and a pad forming unit disposed on an outer region of the chip mounting unit. The semiconductor package further includes a plurality of pads disposed on the pad forming unit of the substrate, a semiconductor chip disposed on the chip mounting unit of the substrate, a dam disposed on the first surface of the substrate between the semiconductor chip and the pad forming unit, and wherein the dam separates at least a portion of the pads from the semiconductor chip. In addition, the semiconductor package further includes an underfill material disposed between an active surface of the semiconductor chip and the first surface of the substrate and wherein an upper surface of the dam is rounded due to surface tension.
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