发明申请
US20110275739A1 EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN
有权
环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，生产新型酚醛树脂的方法和生产新型环氧树脂的方法
- 专利标题： EPOXY RESIN COMPOSITION, CURED ARTICLE THEREOF, SEMICONDUCTOR SEALING MATERIAL, NOVEL PHENOL RESIN, NOVEL EPOXY RESIN, METHOD FOR PRODUCING NOVEL PHENOL RESIN, AND METHOD FOR PRODUCING NOVEL EPOXY RESIN
- 专利标题（中）： 环氧树脂组合物，其固化物，半导体密封材料，新型酚醛树脂，新型环氧树脂，生产新型酚醛树脂的方法和生产新型环氧树脂的方法
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申请号： US13157926申请日： 2011-06-10
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公开(公告)号： US20110275739A1公开(公告)日： 2011-11-10
- 发明人: Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
- 申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
- 申请人地址： JP Tokyo
- 专利权人： DAINIPPON INK AND CHEMICALS, INC.
- 当前专利权人： DAINIPPON INK AND CHEMICALS, INC.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-254144 20040901; JP2004-254145 20040901
- 主分类号： C08L63/00
- IPC分类号： C08L63/00 ; C08G65/40 ; C08G59/04 ; C08G59/62
摘要：
An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
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